A laser system includes a laser configured to emit pulse bursts and a motion device in optical communication with the laser. The motion device moves a laser beam along a process path on a substrate and is configured to have a natural frequency that is greater than an operating frequency of the laser system. The laser system enables high and constant speed processing along tight radii in the process path, which is useful to form laser induced channels along the process path with equal spacing.

This invention provides a method for manufacturing a decorative-part of which the joint-lines bordering the laser-irradiation regions are unnoticeable, thus avoiding deterioration of the design-quality of such a decorative-part. Of this invention, the design (4) comprises the first-blocks (6) of a plurality of design-patterns (5) that are closely arranged with the second-blocks (8) of a plurality of design-patterns (7) that are different from those of the first-blocks (6). In the laser-irradiation-region-setting process, the decorative-area is divided into a plurality of laser-irradiation regions (LR1, LR2 and LR3), at which time the joint-lines (J1, J2) are set as borders of the first-blocks (6) and the second-blocks (8) of the design (4). In the laser-irradiation process, a laser-deflector is relatively displaced, and a laser L is irradiated onto each of the laser-irradiation regions (LR1, LR2 and LR3).

A substrate processing apparatus configured to process a substrate includes a substrate holder configured to hold, in a combined substrate in which a front surface of a first substrate and a front surface of a second substrate are bonded to each other, the second substrate; a periphery modification unit configured to form a peripheral modification layer by radiating laser light for periphery to an inside of the first substrate held by the substrate holder along a boundary between a peripheral portion of the first substrate as a removing target and a central portion thereof; and an internal modification unit configured to form, after the peripheral modification layer is formed by the periphery modification unit, an internal modification layer by radiating laser light for internal surface to the inside of the first substrate held by the substrate holder along a plane direction of the first substrate.

Provided is a method for determining a laser irradiation state whereby the output of a laser can be acquired with high accuracy. This method for determining a laser irradiation state determines the irradiation state of a laser irradiated by a laser irradiation device and includes: an output stabilization time acquisition step for acquiring, as an output stabilization time, the time from the start of laser irradiation by the laser irradiation device until the stabilization of the output of the laser; an energy acquisition step for acquiring, after the output stabilization time or longer has elapsed from the start of the laser irradiation by the laser irradiation device, the energy of the laser irradiated by the laser irradiation device in a pre-set prescribed period; a conversion step for converting the acquired energy to the output of the laser irradiated by the laser irradiation device; and a state determination step for determining the irradiation state of the laser on the basis of the converted output of the laser.

A laser processing apparatus includes a support portion, a laser processing head, a vertical movement mechanism, a horizontal movement mechanism, and a controller. The controller controls starting and stopping of emission of a laser light from the laser processing head based on rotation information in a state where a focusing point is positioned at a position along a circumferential edge of an effective region in a target, while rotating the support portion, to perform a circumferential edge process for forming a modified region along the circumferential edge of the effective region in the target.

A laser processing head includes a tubular main body, and a gas supply part disposed in the main body and allowing an assist gas supplied from outside to flow into an internal space of the main body. The gas supply part includes a first gas supply hole extending along a first axis on a plane orthogonal to an axis of a tube of the main body and opening at an inner circumferential surface of the main body, a second gas supply hole forming a predetermined angle relative to the first axis around the axis extending along a second axis on the plane orthogonal to the axis and opening at the inner circumferential surface, and a flow path forming ring facing the inner circumferential surface with a predetermined interval, and forming a cylindrical space extending along the axis between the flow path forming ring and the inner circumferential surface.

Provided are a housing and a handling method for a processing device that can prevent the adherence of dust particles and the like on a sensor. A housing accommodates a sensor that detects an energy beam. The housing comprises: a chamber provided with a transparent member through which the energy beam can pass; and a supply port for supplying gas into the chamber. The sensor detects an energy beam incident thereon via the transparent member.

An identifier management method is executed by a welding system. The identifier management method includes: acquiring information on identifiers of a plurality of original workpieces; selecting, according to a predetermined rule, any one of the identifiers of the plurality of original workpieces to be adopted based on completion of execution of a welding process using the plurality of original workpieces by the welding system; and setting the any one of identifiers of the plurality of original workpieces, which has been selected, as an identifier of the welded workpiece generated in the welding process.

A laser machining apparatus for machining a workpiece placed and fixed on a table by moving the irradiation position of a laser beam on the workpiece while irradiating the workpiece is provided with: a laser oscillator; a laser irradiation head that emits the laser beam from the laser oscillator toward the workpiece and that is provided with a galvano-scanner for moving a laser beam irradiation position on the surface of the workpiece in two directions; a parallel manipulator that changes the orientation of the laser irradiation head; a slide member that supports the parallel manipulator; and linear feed shaft device that moves the slide member in at least two orthogonal directions relatively to the table.

An example system includes a laser tool configured for downhole movement. The laser tool includes an optical assembly configured to shape a laser beam for output. The laser beam may have an optical power of at least one kilowatt (1 kW). A housing contains the optical assembly. The housing is configured for movement to direct the output laser beam within a wellbore. The movement includes rotation of the laser tool around a longitudinal axis of the housing and tilting the housing relative to a longitudinal axis of the wellbore. A control system is configured to control at least one of the movement of the housing or an operation of the optical assembly to direct the output laser beam within the wellbore.