Patent classifications
B23K26/26
METHOD AND APPARATUS FOR THERMALLY JOINING THERMOPLASTIC FIBER COMPOSITE COMPONENTS, AND COVER FOR A PRESSURIZATION DEVICE SUITABLE FOR THIS PURPOSE
An apparatus for thermally joining thermoplastic fiber composite components includes a pressurization arrangement for jointly covering, at least in a region of a joining zone, thermoplastic fiber composite components to be joined and applying pressure to the thermoplastic fiber composite components to press the thermoplastic fiber composite components against one another, at least in the joining zone, the pressurization arrangement being flexible, at least in some section or sections. A welding device is configured for welding the fiber composite components in the joining zone during pressurization. The pressurization arrangement and welding device are configured to weld the thermoplastic fiber composite components in a pressurized state in the joining zone. The pressurization arrangement is configured to maintain pressurization independently of the welding device until the joining zone solidifies. A cover is also disclosed for a pressurization device for thermally joining thermoplastic fiber composite components.
Method of manufacturing terminal-attached electric wire and terminal-attached electric wire
A method of manufacturing a terminal-attached electric wire includes: installing an electric wire including a core wire including a plurality of element wires to a terminal having a conductor coupling part having a pair of barrel pieces, the core wire being installed between the pair of barrel pieces; bending the pair of barrel pieces to cause the pair of barrel pieces to wrap around and cover the core wire in a circumferential direction to form a slit extending in an axial direction between the pair of barrel pieces, with respect to the circumferential direction; melting the element wires of the core wire by emitting laser light toward the core wire through the slit; and adhering the element wires melted with the laser light to the conductor coupling part.
METHOD FOR LASER WELDING OF MATERIALS HAVING DIFFERENT THICKNESSES
Provided is a laser welding method of materials having different thicknesses that can achieve excellent weld strength regardless of the thickness of a thick plate, and a welded member having different thicknesses. That is, the present invention is characterized by a laser welding method of materials having different thicknesses, including: abutting two plates (10), (12) having different thicknesses such that one surface of the plate (10) and one surface the plate (12) are made flush with each other; and thereafter welding the plates (10), (12) by applying a laser beam (14) to abutting surfaces thereof, wherein the laser beam (14) is made incident obliquely from the flush surface of the thin plate (10) toward an abutting end face (12a) of the thick plate (12), a target position (P) of the laser beam (14) is set on the abutting end face (12a) of the thick plate (12), and a target position depth D in the plate from a surface thereof on the incident side of the laser beam (14) is set within a range of the following expression (1), t/3≦D≦t . . . (1) (where t is a thickness, in a planar direction, of an abutting end face (10a) of the thin plate (10), and D and t are both given in mm).
METHOD FOR LASER WELDING OF MATERIALS HAVING DIFFERENT THICKNESSES
Provided is a laser welding method of materials having different thicknesses that can achieve excellent weld strength regardless of the thickness of a thick plate, and a welded member having different thicknesses. That is, the present invention is characterized by a laser welding method of materials having different thicknesses, including: abutting two plates (10), (12) having different thicknesses such that one surface of the plate (10) and one surface the plate (12) are made flush with each other; and thereafter welding the plates (10), (12) by applying a laser beam (14) to abutting surfaces thereof, wherein the laser beam (14) is made incident obliquely from the flush surface of the thin plate (10) toward an abutting end face (12a) of the thick plate (12), a target position (P) of the laser beam (14) is set on the abutting end face (12a) of the thick plate (12), and a target position depth D in the plate from a surface thereof on the incident side of the laser beam (14) is set within a range of the following expression (1), t/3≦D≦t . . . (1) (where t is a thickness, in a planar direction, of an abutting end face (10a) of the thin plate (10), and D and t are both given in mm).
Method and apparatus for producing tailored sheet-metal strips
The invention relates to a method for producing tailored sheet-metal strips, in which at least one sheet-metal strip having a substantially planar surface is integrally connected along its longitudinal edge to at least one further web-shaped semifinished product made of metal, wherein the at least one further web-shaped semifinished product differs from the at least one sheet-metal strip in terms of at least one of its properties, and wherein the at least one sheet-metal strip and the at least one further web-shaped semifinished product are fed continuously to at least one joining station, characterized in that a web-shaped semifinished product having a three-dimensional structure, a hollow profile and/or a multiplicity of recesses and/or holes in succession along its longitudinal edge is used as the at least one further web-shaped semifinished product which is fed to the joining station. An apparatus for carrying out the method is furthermore claimed.
Method and apparatus for producing tailored sheet-metal strips
The invention relates to a method for producing tailored sheet-metal strips, in which at least one sheet-metal strip having a substantially planar surface is integrally connected along its longitudinal edge to at least one further web-shaped semifinished product made of metal, wherein the at least one further web-shaped semifinished product differs from the at least one sheet-metal strip in terms of at least one of its properties, and wherein the at least one sheet-metal strip and the at least one further web-shaped semifinished product are fed continuously to at least one joining station, characterized in that a web-shaped semifinished product having a three-dimensional structure, a hollow profile and/or a multiplicity of recesses and/or holes in succession along its longitudinal edge is used as the at least one further web-shaped semifinished product which is fed to the joining station. An apparatus for carrying out the method is furthermore claimed.
Laser welding of transparent and opaque materials
Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.
Laser welding of transparent and opaque materials
Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.
METHOD FOR PRODUCING A PRIMARY MATERIAL FOR A CUTTING TOOL
A method for producing a primary material for a cutting tool, for example a primary material for a saw blade or a saw band, in which a band-shaped carrier of a metal carrier material and a wire of high-speed steel are continuously brought together along a lateral edge of the band-shaped carrier and transported into a welding device and the band-shaped carrier is welded to the wire along the lateral edge of the carrier to produce a bimetal band. The band-shaped carrier and the edge wire are welded to one another by at least a first welding device, which is arranged on one side of the band-shaped carrier, and at least a second welding device, which is arranged on the opposite side of the band-shaped carrier.
METHOD FOR PRODUCING A PRIMARY MATERIAL FOR A CUTTING TOOL
A method for producing a primary material for a cutting tool, for example a primary material for a saw blade or a saw band, in which a band-shaped carrier of a metal carrier material and a wire of high-speed steel are continuously brought together along a lateral edge of the band-shaped carrier and transported into a welding device and the band-shaped carrier is welded to the wire along the lateral edge of the carrier to produce a bimetal band. The band-shaped carrier and the edge wire are welded to one another by at least a first welding device, which is arranged on one side of the band-shaped carrier, and at least a second welding device, which is arranged on the opposite side of the band-shaped carrier.