A metal member includes a first plate, and a second plate abutting against and welded to the first plate in at least one butt portion. In the butt portion, a length from a first end to a second end of a welding boundary line between the first plate and the second plate is longer than a length of a straight line connecting the first end to the second end of the welding boundary line.

A metal member includes a first plate, and a second plate abutting against and welded to the first plate in at least one butt portion. In the butt portion, a length from a first end to a second end of a welding boundary line between the first plate and the second plate is longer than a length of a straight line connecting the first end to the second end of the welding boundary line.

A method for producing ribbed pipes, in which a first pipe base body is ribbed on its outer side, in particular helically, with a first band, to which end the first band is secured to the first pipe base body using a first laser beam. While the first band is being secured to the first pipe base body using the first laser beam, a second pipe base body is ribbed on its outer side with a second band, to which end the second band is secured to the second pipe base body using a second laser beam, wherein the first and second laser beams come from the same laser source.

A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q.sub.1) of the contact area from the radiative reflection.

A process for producing and/or checking an assembly of a substrate stack includes: planarly arranging at least one first substrate against a second substrate to form the substrate stack, the at least one first substrate and the second substrate being arranged directly against one another or on one another, so that at least one contact area is formed between the least one first substrate and the second substrate at which the at least one first substrate is in direct planar contact with the second substrate, the at least one first substrate including a transparent material; detecting a radiative reflection which comes about through irradiation of the substrate stack with a radiative input on the at least one contact area; and ascertaining a first bond quality index (Q.sub.1) of the contact area from the radiative reflection.

The present disclosure provides a process for manufacturing a light-alloy hybrid wheel comprising the following separate operation phases: obtaining a front flange with an internal profile including a tire bead seat; obtaining a rim with an annular profile including a tire bead seat at a first end and a circular flank for assembly with a part of the flange at a second end; and assembling the flange and the rim to form a wheel. The annular profiles of the flange and the rim form exterior and interior sides of the wheel. Assembling the flange and the rim comprises welding the flank of the rim and the flange together by a single friction stir weld using a pin such that the weld is exposed at the exterior and interior sides of the wheel.

The present disclosure provides a process for manufacturing a light-alloy hybrid wheel comprising the following separate operation phases: obtaining a front flange with an internal profile including a tire bead seat; obtaining a rim with an annular profile including a tire bead seat at a first end and a circular flank for assembly with a part of the flange at a second end; and assembling the flange and the rim to form a wheel. The annular profiles of the flange and the rim form exterior and interior sides of the wheel. Assembling the flange and the rim comprises welding the flank of the rim and the flange together by a single friction stir weld using a pin such that the weld is exposed at the exterior and interior sides of the wheel.

In a battery case sealing method, a lid is fitted to an opening of a battery case, and then a side wall on an inner side of the battery case and a side surface of the lid are brought into contact with each other. The side wall forms the opening. In a state where the side wall on the inner side of the battery case is in contact with the side surface of the lid, a boundary portion between the side wall and the side surface of the lid is welded by irradiating a laser beam in a direction from an outer side of the battery case toward the inner side of the battery case in a thickness direction of the lid.

In a battery case sealing method, a lid is fitted to an opening of a battery case, and then a side wall on an inner side of the battery case and a side surface of the lid are brought into contact with each other. The side wall forms the opening. In a state where the side wall on the inner side of the battery case is in contact with the side surface of the lid, a boundary portion between the side wall and the side surface of the lid is welded by irradiating a laser beam in a direction from an outer side of the battery case toward the inner side of the battery case in a thickness direction of the lid.

A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.