An electrode manufacturing device for manufacturing an electrode includes: a first support unit having a plate shape extending along a plane and injecting a first pressurized fluid in a 1.sup.st-1.sup.st direction perpendicular to the plane; a second support unit having a plate shape extending along one plane, disposed to face the first support unit at a certain distance, and injecting a second pressurized fluid in a 1.sup.st-2.sup.nd direction opposite to the 1.sup.st-1.sup.st direction; a transfer unit configured to transfer an electrode having a sheet-shape in a direction of gravity and dispose a first area of the electrode between the first support unit and the second support unit; and a laser beam notching unit configured to notch and cut a portion of a second area of the electrode by irradiating a laser beam to the electrode in the 1.sup.st-1.sup.st direction.

A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

A laser processing device includes a laser oscillator, an optical fiber that is a multi-clad fiber, a beam control mechanism provided in the laser oscillator, and a laser light emitting head attached to the optical fiber. The beam control mechanism includes a condenser lens, an optical path changing and holding mechanism that is disposed between the condenser lens and an incident end face of the optical fiber and changes an optical path of laser light LB, and a controller that controls an operation of the optical path changing and holding mechanism. The beam control mechanism controls a power distribution of the laser light by changing an incident position of the laser light on the incident end face.

A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90).

Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

A laser processing device includes a laser oscillator, optical fiber (90), beam control mechanism (20), and a laser light emitting head. The laser oscillator includes first and second laser oscillation units that generate first and second laser light rays (LB1) and (LB2), respectively. Beam control mechanism (20) includes optical path changing and holding mechanism (40) that is disposed between second condenser lens (32) that condenses second laser light (LB2) and dichroic mirror (33) that multiplexes first and second laser light rays (LB1) and (LB2) and causes the multiplexed light to be incident on optical fiber (90).

Beam control mechanism (20) changes an incident position of second laser light (LB2) on optical fiber (90).

An automated laser cutting station for the production of semi-finished components for prosthetic surgery instruments able, in use, to carry out tissue removal processes. Said automated station comprises at least a first automated operator, a laser cutting apparatus, and a control unit. The present invention also relates to a relative method for the production of such a semi-finished component, and to the semi-finished component thus obtained.

An automated laser cutting station for the production of semi-finished components for prosthetic surgery instruments able, in use, to carry out tissue removal processes. Said automated station comprises at least a first automated operator, a laser cutting apparatus, and a control unit. The present invention also relates to a relative method for the production of such a semi-finished component, and to the semi-finished component thus obtained.

A drilling device with a controllable femtosecond laser processing taper includes a femtosecond laser and a precision motion table. A support mechanism is provided along the central axis of the precision motion table, and a clamp is provided on the top of the support mechanism. The output end of the femtosecond laser is provided with a beam expander. The output end of the beam expander is provided with a reflection mirror. The output end of the reflection mirror is provided with a beam scanning module. The output end of the beam scanning module is provided with a semi-focusing mirror. The output end of the semi-focusing mirror is provided with a semi-transmissive reflection mirror arranged at 45 degrees. The reflection output end of the semi-transmissive reflection mirror is provided with a high-precision three-dimensional on-line monitoring module, and the transmission output end of the semi-transmissive reflection mirror faces the clamp.

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.