A method for preparing a conductive circuit can begin with the preparation of a non-conductive substrate having a top surface and a bottom surface, and then utilizing a pulse laser to create a top circuit pattern upon the top surface, a bottom circuit pattern upon the bottom surface, and a through hole connecting the top circuit pattern with the bottom circuit pattern. Subsequently, a conductive circuit is formed upon the top circuit pattern and the bottom circuit pattern and inside the through hole, wherein the conductive circuit is restricted from being formed upon the top surface outside of the top isolation region and the bottom surface outside of the bottom isolation region.

Three systems for the destruction of the data storage portion of electronic media storage devices such as hard disk drives, solid state drives and hybrid hard drives. One system utilizes a mill cutter with which the hard drive has relative motion in the direction of the axis of the mill cutter to destroy the data storage portion. A second system utilizes a laser to physically destroy the data storage portion. The third system utilizes a chemical solvent to chemically destroy the data storage portion.

Three systems for the destruction of the data storage portion of electronic media storage devices such as hard disk drives, solid state drives and hybrid hard drives. One system utilizes a mill cutter with which the hard drive has relative motion in the direction of the axis of the mill cutter to destroy the data storage portion. A second system utilizes a laser to physically destroy the data storage portion. The third system utilizes a chemical solvent to chemically destroy the data storage portion.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

A laser machining device includes a laser machining head and a control unit. The laser machining head applies laser for machining an object to be machined, and includes a first laser light source for first laser, a second laser light source for second laser having a different pulse width different from the first laser, a condensing optical system provided between the object and the laser light sources to condense at least the lasers on the object, a switch mechanism provided between the condensing optical system and the laser light sources so that the switch mechanism is movable to a position that at least one of the lasers enters the condensing optical system, and an irradiation angle change mechanism provided between the condensing optical system and the switch mechanism to change an irradiation angle of the first laser. The control unit controls the laser machining head.

A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz.

Provided is a gas discharge roil, which includes: an inner roll, which has a rotary shaft; an outer roll, which is fitted and integrated with an outer peripheral surface of the inner roll; gas introduction grooves, which are formed on the outer peripheral surface of the inner roll over an entire circumference thereof at substantially uniform intervals along a circumferential direction of the inner roll so as to extend along a rotary shaft direction of the inner roll, and which are configured to define gas introduction channels between an inner peripheral surface of the outer roll and the gas introduction grooves; and a group of gas discharge holes formed on the outer roll so as to penetrate through to the gas introduction channels. A circumferential cutoff rate of a gas introduction channel cross-section is 36% or less, or a porosity within a gas introduction range is 20% or less.

Provided is a gas discharge roil, which includes: an inner roll, which has a rotary shaft; an outer roll, which is fitted and integrated with an outer peripheral surface of the inner roll; gas introduction grooves, which are formed on the outer peripheral surface of the inner roll over an entire circumference thereof at substantially uniform intervals along a circumferential direction of the inner roll so as to extend along a rotary shaft direction of the inner roll, and which are configured to define gas introduction channels between an inner peripheral surface of the outer roll and the gas introduction grooves; and a group of gas discharge holes formed on the outer roll so as to penetrate through to the gas introduction channels. A circumferential cutoff rate of a gas introduction channel cross-section is 36% or less, or a porosity within a gas introduction range is 20% or less.