A component is provided and includes a substrate comprising an outer and an inner surface, where the inner surface defines at least one hollow, interior space. The component defines one or more grooves, where each groove extends at least partially along the outer surface of the substrate and has a base and a top. The base is wider than the top, such that each groove comprises a re-entrant shaped groove. One or more access holes are formed through the base of a respective groove, to connect the groove in fluid communication with the respective hollow interior space. Each access hole has an exit diameter D that exceeds the opening width d of the top of the respective groove. The diameter D is an effective diameter based on the area enclosed. The component further includes at least one coating disposed over at least a portion of the surface of the substrate, wherein the groove(s) and the coating together define one or more re-entrant shaped channels for cooling the component. A method for manufacturing the component is also provided. A method for manufacturing a component is also provided, where the groove and the access hole(s) are machined as a single continuous process, such that the groove and the access hole(s) form a continuous cooling passage.

An electrode for electrical discharge machining (EDM) may comprise a diffuser portion and a tapered portion defining the tip of the electrode. A method for forming a film cooling hole may comprise moving a tool with respect to a film cooled gaspath component, forming a diffuser of the film cooling hole in response to the moving, and forming a tapered surface between a metering section and the diffuser of the film cooling hole.

An electrode for electrical discharge machining (EDM) may comprise a diffuser portion and a tapered portion defining the tip of the electrode. A method for forming a film cooling hole may comprise moving a tool with respect to a film cooled gaspath component, forming a diffuser of the film cooling hole in response to the moving, and forming a tapered surface between a metering section and the diffuser of the film cooling hole.

A method for fabricating a nanopore at a particular location in a membrane includes controlling a dielectric strength of the membrane at a particular location on the membrane while applying one of an electric potential or an electric current to the membrane, monitoring an electrical property across the membrane while one of the electric potential or the electric current is being applied across the membrane, detecting an abrupt change in the electrical property across the membrane while one of the electric potential or the electric current is being applied across the membrane; and removing the electric potential or the electric current from the membrane in response to detecting the abrupt change in the electrical property.

A method for fabricating a nanopore at a particular location in a membrane includes controlling a dielectric strength of the membrane at a particular location on the membrane while applying one of an electric potential or an electric current to the membrane, monitoring an electrical property across the membrane while one of the electric potential or the electric current is being applied across the membrane, detecting an abrupt change in the electrical property across the membrane while one of the electric potential or the electric current is being applied across the membrane; and removing the electric potential or the electric current from the membrane in response to detecting the abrupt change in the electrical property.

A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (m) and a plate thickness t (m) which satisfy the equation d0.0448.Math.t1.28.

A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (m) and a plate thickness t (m) which satisfy the equation d0.0448.Math.t1.28.

A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

A light emitting method includes passing a laser beam through at least one offset assembly and a focusing assembly in sequence, and actuating, by a control-manipulating mechanism, the offset assembly to cause the laser beam to be offset, so that the laser beam can quickly produce a controllable opening of any shape in a drilling process.

A manufacturing method for a printed circuit board for positioning a laser beam output from a laser output device by using a galvano device and an f lens and forming a hole in the printed circuit board including a copper layer and an insulating layer, the method including forming a through-hole in the copper layer by the laser beam whose outer diameter is shaped by a first aperture, and processing the insulating layer by the laser beam whose outer diameter is shaped by a second aperture having a smaller diameter than the first aperture.