An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.110.sup.6/K to 3.410.sup.6/K. The interposer further includes a number of holes having diameters ranging from 20 m to 200 m. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

A method of forming openings in a polymer layer includes positioning a layer of a material over a cavity such that a portion of the first material lies over a cavity, ablating the portion of the material at a first shape, and ablating the portion of the material at a second shape, wherein the second shape lies within the first shape. A method of forming openings in a polymer layer includes positioning a layer of a first material over a second material having a cavity such that a portion of the first material lies over the cavity, ablating the portion of the first material over the cavity at a first shape, and ablating the portion of the second material over the cavity at a second shape, wherein the second shape lies within the first shape.

A processing method of producing a processed object by processing a material, includes forming a hollow space in the processed object by processing by ablation, the processing being performed by projecting a laser to a region in the material to be processed.

A processing method of producing a processed object by processing a material, includes forming a hollow space in the processed object by processing by ablation, the processing being performed by projecting a laser to a region in the material to be processed.

A method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforations, holes, or capillaries having a selected diameter. The perforated hydrogel material or adhesive can be used in wound care dressings, wearable sensors, or devices intended to contact living tissue. The perforated material or adhesive may also be provided in contact with an exudate holding mechanism such as an open cell foam material to further increase the exudate absorbance of the hydrogel or hydrocolloid wound care dressing.

A method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforations, holes, or capillaries having a selected diameter. The perforated hydrogel material or adhesive can be used in wound care dressings, wearable sensors, or devices intended to contact living tissue. The perforated material or adhesive may also be provided in contact with an exudate holding mechanism such as an open cell foam material to further increase the exudate absorbance of the hydrogel or hydrocolloid wound care dressing.

A gas permeable glass window, suitable for use with liquid interface additive manufacturing, has an optically transparent glass article greater than about 0.5 millimeters in thickness defining a first surface and a second surface. A plurality of gas channels are disposed through the article from the first surface to the second surface. The gas channels occupy less than about 1.0% of a surface area of the article and are configured such that the article has a gas permeability between about 10 barrers and about 2000 barrers.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

A method for laser drilling holes on a moving web of material wherein the laser system can be used to drill holes having a diameter less than about 300 micron and holes having a diameter greater than about 300 micron without increasing the energy of the laser beam, and without laser profiling the hole to increase the diameter. The method comprises pulsing the laser beam a plurality of times while directing the focal point of the laser beam for each pulse on to the same target area on the material to produce a hole having an increased diameter.