A method for cutting passages in an airfoil using a liquid-jet guided laser beam includes positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location that is defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil. The method also includes generating a laser beam confined within a fluid column via the liquid jet guided laser, wherein the laser beam is aimed at the outer surface. The method further includes monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil, shutting off the laser beam once breakthrough is detected and repositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance. A system for cutting a passage in an airfoil is also disclosed herein.

A method for cutting passages in an airfoil using a liquid-jet guided laser beam includes positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location that is defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil. The method also includes generating a laser beam confined within a fluid column via the liquid jet guided laser, wherein the laser beam is aimed at the outer surface. The method further includes monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil, shutting off the laser beam once breakthrough is detected and repositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance. A system for cutting a passage in an airfoil is also disclosed herein.

A method of forming openings in a polymer layer includes positioning a layer of a material over a cavity such that a portion of the first material lies over a cavity, ablating the portion of the material at a first shape, and ablating the portion of the material at a second shape, wherein the second shape lies within the first shape. A method of forming openings in a polymer layer includes positioning a layer of a first material over a second material having a cavity such that a portion of the first material lies over the cavity, ablating the portion of the first material over the cavity at a first shape, and ablating the portion of the second material over the cavity at a second shape, wherein the second shape lies within the first shape.

A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (μm) and a plate thickness t (μm) which satisfy the equation d≦0.0448.Math.t−1.28.

Machining device comprising an optical trepanation head (1), comprising an opto-mechanical system having a head body (21) provided with a rotating device (22), a picosecond or femtosecond pulsed laser source (3), and at least one optical fiber (4) wherein the rotation device (22) of the opto-mechanical system (2) comprises a rotative diffraction grating (R1). Machining process by means of optical trepanation using such a device.

Machining device comprising an optical trepanation head (1), comprising an opto-mechanical system having a head body (21) provided with a rotating device (22), a picosecond or femtosecond pulsed laser source (3), and at least one optical fiber (4) wherein the rotation device (22) of the opto-mechanical system (2) comprises a rotative diffraction grating (R1). Machining process by means of optical trepanation using such a device.

A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

A method is for processing a cooling hole on a workpiece with laser. The cooling hole includes a shaped hole section. The method includes emitting a first laser pulse to a rough processing part in the position of the shaped hole section to be processed on the workpiece according to the geometrical parameters of the shaped hole section so as to remove the material of the workpiece; and emitting a second laser pulse to the processing allowance part beyond the rough processing part of the shaped hole section to be processed according to the geometrical parameters of the shaped hole section so as to remove the material allowance of the workpiece on the processing allowance part. The energy of the first laser pulse is relatively larger than that of the second laser pulse.

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The physiological sensor is operable to analyze biological fluids such as sweat.