A system for forming a cooling hole in an airfoil includes a liquid-jet guided laser. The liquid-jet guided laser generates a laser beam confined within a fluid column. The fluid column/laser beam is directed at an outer surface of the airfoil. The system also includes a purge medium supply that is fluidly coupled to an aperture of the airfoil. The purge medium supply provides a purge medium into an inner cavity of the airfoil. The purge medium flow is oriented to flow in a flow direction that is substantially parallel to an inner surface of the cavity. A cooling hole is formed in the airfoil and extends through the outer surface and penetrates the inner surface of the cavity. A centerline of the cooling hole forms an acute angle with respect to the purge medium flow direction. The system described herein provides a method for manufacturing an airfoil.

Disclosed herein is a laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from, the front side of the wafer to the back side thereof, by one shot of the laser beam.

A ceiling tile comprises a first layer of material and a second layer of a structurally stiff material distinct from the material of the first layer, positioned to be below the first layer when installed in a ceiling, wherein the second layer can support its weight and the weight of other layers. The first layer is visible through the openings in the second layer when installed. The second layer might be steel, aluminum, copper, bronze, brass, or iron with openings cut into the second layer. The first layer can be acoustical fiber, wool, fabric, wood, leather, rubber, and acrylic and supported the second layer, with the openings being sufficiently arranged so that the first layer is fully supported by portions of the second layer that are not the openings. Three or more layers are also possible, with some or all of the layers are visible through lower layers.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

The present disclosure is directed toward a machine tool configured to perform small-scale, high-accuracy drilling operations for small-hole applications. The small-hole applications for which the machine tool is designed includes holes with one or more diameters. A part may have a larger-diameter hole that penetrates through a fraction of the thickness of a part and a smaller-diameter hole that penetrates from the bottom of the larger-diameter hole through the remainder of the part thickness. Additionally, the machine tool may be used with parts in any of the following categories: (i) both the step-hole and the flow-hole are created using the machine tool; or, (ii) the step-hole is created with an up-stream process and the machine tool may accept the part, measure the step-holes and create the flow-holes; or, (iii) no step-hole is used and the machine tool may accept the part, measure the raw surface and create the flow-holes.

The present disclosure is directed toward a machine tool configured to perform small-scale, high-accuracy drilling operations for small-hole applications. The small-hole applications for which the machine tool is designed includes holes with one or more diameters. A part may have a larger-diameter hole that penetrates through a fraction of the thickness of a part and a smaller-diameter hole that penetrates from the bottom of the larger-diameter hole through the remainder of the part thickness. Additionally, the machine tool may be used with parts in any of the following categories: (i) both the step-hole and the flow-hole are created using the machine tool; or, (ii) the step-hole is created with an up-stream process and the machine tool may accept the part, measure the step-holes and create the flow-holes; or, (iii) no step-hole is used and the machine tool may accept the part, measure the raw surface and create the flow-holes.

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

A bonded structure is made of a first member and a second member which are bonded to each other. At least one bore having an opening is formed in a surface of the first member, and the second member is filled in the bore of the first member. The bore is defined by a diameter-increasing portion whose opening size increases in a depth direction from a surface side toward a bottom of the first member, and a first diameter-decreasing portion whose opening size decreases in the depth direction from the surface side toward the bottom. The diameter-increasing portion is formed on the surface side, and the first diameter-decreasing portion is formed on a bottom side.