A method for manufacturing a stone for a timepiece from a mineral body of a monocrystalline type, the stone including a hole, includes ablating the body by scanning at least one face of the body with ultra-short pulse laser radiation from a laser for a duration less than one hundred picoseconds, and guiding a beam of the laser radiation using a precession system of at least three axes configured to at least partially cancel a conical focusing angle of the laser. The ablating includes digging of a cone of entrance to the hole. A mineral stone of monocrystalline type for a timepiece includes a face provided with a hole formed in a body of the stone, and a functional element at an entrance to the hole. The functional element has a shape of a cone.

A method for manufacturing a stone for a timepiece from a mineral body of a monocrystalline type, the stone including a hole, includes ablating the body by scanning at least one face of the body with ultra-short pulse laser radiation from a laser for a duration less than one hundred picoseconds, and guiding a beam of the laser radiation using a precession system of at least three axes configured to at least partially cancel a conical focusing angle of the laser. The ablating includes digging of a cone of entrance to the hole. A mineral stone of monocrystalline type for a timepiece includes a face provided with a hole formed in a body of the stone, and a functional element at an entrance to the hole. The functional element has a shape of a cone.

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10.sup.−6/K to 3.4×10.sup.−6/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

An interposer for electrical connection between a CPU chip and a circuit board is provided. The interposer includes a board-shaped base substrate made of glass having a coefficient of thermal expansion ranging from 3.1×10.sup.−6/K to 3.4×10.sup.−6/K. The interposer further includes a number of holes having diameters ranging from 20 μm to 200 μm. The number of holes ranging from 10 to 10,000 per square centimeter. Conductive paths running on one surface of the board extend right into respective holes and therethrough to the other surface of the board in order to form connection points for the chip.

A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.

A computer-implemented method for optimizing control of a process includes a computer receiving a process definition and a collection of elements to be arranged in a way that optimizes the utility of the process; initializing the process using a collection of discrete elements (stops, events, work orders, tasks, locations, etc.), and producing a solution for the collection by inserting the elements into the solution using the Minimum Insertion Heuristic; modifying the order of the elements to be inserted and continuing the process to produce solutions with better scores; and continuing to produce solutions based on improving the order of insertion until the process is determined to be sufficiently optimized.

A computer-implemented method for optimizing control of a process includes a computer receiving a process definition and a collection of elements to be arranged in a way that optimizes the utility of the process; initializing the process using a collection of discrete elements (stops, events, work orders, tasks, locations, etc.), and producing a solution for the collection by inserting the elements into the solution using the Minimum Insertion Heuristic; modifying the order of the elements to be inserted and continuing the process to produce solutions with better scores; and continuing to produce solutions based on improving the order of insertion until the process is determined to be sufficiently optimized.

A method of forming a passage in a turbine component includes: using an additive manufacturing process to form a first support structure on a first surface of the turbine component; forming a second support structure on a second surface of the turbine component, the second support structure being spaced apart from the first support structure; and forming a passage in the turbine component between the first and second support structures.

A method of forming a passage in a turbine component includes: using an additive manufacturing process to form a first support structure on a first surface of the turbine component; forming a second support structure on a second surface of the turbine component, the second support structure being spaced apart from the first support structure; and forming a passage in the turbine component between the first and second support structures.

Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.