B23K26/384

METHOD AND APPARATUS FOR FORMING HOLES IN BRITTLE MATERIALS ASSISTED BY STRESS REDUCTION THROUGH HEATING

A method of making a brittle substrate comprising the steps of: (i) heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500° C., but below 1500° C., to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of the brittle substrate with a laser beam emitted from an IR laser to form at least one hole in the brittle substrate.

METHOD AND APPARATUS FOR FORMING HOLES IN BRITTLE MATERIALS ASSISTED BY STRESS REDUCTION THROUGH HEATING

A method of making a brittle substrate comprising the steps of: (i) heating at least a portion of the substrate at least to the depth d to a temperature Tp that is above 500° C., but below 1500° C., to form a heated area of the substrate; and (ii) irradiating at least a portion of the heated area of the brittle substrate with a laser beam emitted from an IR laser to form at least one hole in the brittle substrate.

Methods of ferrule reshaping for correcting core-to-ferrule concentricity errors, and optical fiber cable assemblies related to such methods

Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.

Methods of ferrule reshaping for correcting core-to-ferrule concentricity errors, and optical fiber cable assemblies related to such methods

Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.

Method for manufacturing a biological fluid sensor
11389140 · 2022-07-19 · ·

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

Method for manufacturing a biological fluid sensor
11389140 · 2022-07-19 · ·

The present invention presents a method of fabrication for a physiological sensor with electronic, electrochemical, and chemical components. The fabrication method comprises steps for manufacturing an apparatus comprising at least one electrochemical sensor, a microcontroller, and a transceiver. The fabrication process includes the steps of substrate fabrication, circuit fabrication, pick and place, reflow soldering, electrode fabrication, membrane fabrication, sealing and curing, layer bonding, and dressing. The physiological sensor is operable to analyze biological fluids such as sweat.

Systems and methods for manufacturing film cooling hole diffuser portion

A gas path component for a gas turbine engine includes a film cooling hole disposed in the gas path component. The film cooling hole includes a metering section, a diffuser, and a tapered surface extending between the metering section and the diffuser. The tapered surface is oriented between twenty degrees and seventy degrees with respect to a centerline axis of the metering section. The tapered surface is oriented at an obtuse angle with respect to an immediately adjacent surface of the diffuser, the obtuse angle is open towards the centerline axis. The tapered surface is configured to mitigate flow separation in the diffuser.

Systems and methods for manufacturing film cooling hole diffuser portion

A gas path component for a gas turbine engine includes a film cooling hole disposed in the gas path component. The film cooling hole includes a metering section, a diffuser, and a tapered surface extending between the metering section and the diffuser. The tapered surface is oriented between twenty degrees and seventy degrees with respect to a centerline axis of the metering section. The tapered surface is oriented at an obtuse angle with respect to an immediately adjacent surface of the diffuser, the obtuse angle is open towards the centerline axis. The tapered surface is configured to mitigate flow separation in the diffuser.

METHOD OF FABRICATING A THROUGH GLASS VIA ON A SUSPENDED NANOCRYSTALLINE DIAMOND

Low-cost and robust platforms are key for the development of next-generation 3D micro- and nanodevices. To fabricate such platforms, nanocrystalline diamond (NCD) is a highly appealing material due to its biocompatibility, robustness, and mechanical, electrical, electrochemical, and optical properties, while glass substrates with through vias are ideal interposers for 3D integration due to the excellent properties of glass. A low-cost process—free of photolithography and transfer printing—for fabricating arrays of TGVs that are sealed with suspended portions of an ultra-thin NCD film on one side is presented. These highly transparent structures may serve as a platform for the development of microwells for single-cell culture and analysis, 3D integrated devices such as microelectrodes, and quantum technologies. It is also possible to replace the NCD with silicon nitride or silicon carbide, allowing for the development of complex heterogeneous structures on a small scale.

LASER PROCESSING METHOD OF PRINTED CIRCUIT BOARD AND LASER PROCESSING MACHINE FOR PRINTED CIRCUIT BOARD

A laser processing method includes providing a unit configured to obtain time t0 from a time when the high-frequency pulse RF output is turned on to a time when the laser is actually output in advance and change a traveling direction of the laser in an optical path of the laser, irradiating the workpiece with all the lasers while the high-frequency pulse RF output is turned on, and removing at least a part of the laser from the workpiece simultaneous with turning off the high-frequency pulse RF output.