Patent classifications
B23K26/386
Forming lined cooling aperture(s) in a turbine engine component
A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.
Forming lined cooling aperture(s) in a turbine engine component
A manufacturing method is provided. During this method, a preform component is provided for a turbine engine. The preform component includes a substrate. A meter section of a cooling aperture is formed in the substrate. An internal coating is applied onto a surface of the meter section. An external coating is applied over the substrate. A diffuser section of the cooling aperture is formed in the external coating and the substrate to provide the cooling aperture.
FIXATION LEG FOR A VEHICLE INTERIOR PANEL AND METHOD OF MANUFACTURING SAME
A fixation leg for a vehicle interior panel includes an impact energy absorption region having one or more partial or complete perforations. Each one of the perforations may be formed by laser ablating material from the fixation leg at the impact energy absorption region. The impact energy absorption region is weakened due to the partial or complete perforations such that upon impact with the vehicle interior panel, the fixation leg can break and absorb some of the impact energy. In one embodiment, the fixation leg attaches a substrate of a vehicle instrument panel to a structural crossmember.
Puncture forming method, sample separating method, semiconductor element manufacturing method, semiconductor laser element manufacturing method, and semiconductor laser element
A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction.
INNER BARREL OF AN ENGINE INLET WITH LASER-MACHINED ACOUSTIC PERFORATIONS
A forming system includes a femtosecond laser and a control unit that includes one or more processors operatively connected to the femtosecond laser. The femtosecond laser is configured to emit laser pulses onto an inner surface of a face sheet of an acoustic inner barrel. The acoustic inner barrel includes an acoustic core comprising an array of hexagonal cells attached to an outer surface of the face sheet that is opposite the inner surface. The control unit is configured to control the femtosecond laser to laser drill a plurality of perforations in the face sheet via emitting laser pulses at pulse durations between about 100 femtoseconds and about 10,000 femtoseconds and at frequencies over 100,000 Hz such that the perforations are formed without burning portions of the face sheet or the acoustic core surrounding the perforations.
METHOD FOR PRODUCING FINE STRUCTURES IN THE VOLUME OF A SUBSTRATE COMPOSED OF HARD BRITTLE MATERIAL
A method for producing a cavity in a substrate composed of hard brittle material is provided. A laser beam of an ultrashort pulse laser is directed a side surface of the substrate and is concentrated by a focusing optical unit to form an elongated focus in the substrate. Incident energy of the laser beam produces a filament-shaped flaw in a volume of the substrate. The filament-shaped flaw extends into the volume to a predetermined depth and does not pass through the substrate. To produce the filament-shaped flaw, the ultrashort pulse laser radiates in a pulse or a pulse packet having at least two successive laser pulses. After at least two filament-shaped flaws are introduced, the substrate is exposed to an etching medium which removes material of the substrate and widens the at least two filament-shaped flaws to form filaments. At least two filaments are connected to form a cavity.
TWO-DIMENSIONAL DATA MATRIX STRUCTURE AND THE FABRICATION METHOD THEREOF
A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.
TWO-DIMENSIONAL DATA MATRIX STRUCTURE AND THE FABRICATION METHOD THEREOF
A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.
Work piece including a sacrificial cover layer for laser drilling substrates
A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
Work piece including a sacrificial cover layer for laser drilling substrates
A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.