A functional member includes: a plurality of microneedles on a surface. Further, the microneedles adjacent to each other are spaced apart by a pitch ranging from 1 to 500 m, and the microneedles have a diameter ranging from 0.25 to 250 m and have a height ranging from 5 to 200 m.

A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

Provided is a multi-junction solar cell in which two or more absorption layers having different bandgaps are stacked on one another. The multi-junction solar cell includes a first cell including a first absorption layer, and a second cell electrically connected in series onto the first cell, wherein the second cell includes a second absorption layer having a higher bandgap compared to the first absorption layer, and a plurality of recesses penetrating through the second absorption layer.

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.

A chip card body including a metal plate, a reception region in the metal plate for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region; and at least one through-opening in the metal plate and configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

A chip card body including a metal plate, a reception region in the metal plate for receiving a chip and configured for inductive coupling of the metal plate to a chip received in the reception region; and at least one through-opening in the metal plate and configured such that at least a part of the metal plate acts as an antenna for delivering an electromagnetic signal to the reception region.

A method for producing a structural material stack includes forming a composite panel that includes a carbon fiber reinforced polymer (CFRP) material, and applying an interface film on an exterior composite surface of the composite panel. The interface film is electrically conductive. The method includes performing an electroplating process to form a metallic coating on the interface film such that the interface film is sandwiched between the composite panel and the metallic coating. The metallic coating has a different material composition than the interface film.

A method for producing a structural material stack includes forming a composite panel that includes a carbon fiber reinforced polymer (CFRP) material, and applying an interface film on an exterior composite surface of the composite panel. The interface film is electrically conductive. The method includes performing an electroplating process to form a metallic coating on the interface film such that the interface film is sandwiched between the composite panel and the metallic coating. The metallic coating has a different material composition than the interface film.