A laser processing method includes a first step of irradiating a surface of a composite material with laser to form a hole processing groove on the composite material in a manner of scanning paths from an outside corresponding to an inner peripheral surface side of the through hole to be formed to an inside corresponding to a center side of the through hole, the paths being across a width direction of the hole processing groove; and a second step of irradiating and penetrating through the hole processing groove with the laser to form the through hole in a manner of scanning paths from the outside to the inside after the first step, the paths being across the width direction of the hole processing groove. The laser used at the first step has a smaller heat input amount per unit time than the laser used at the second step.

A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

A laser processing apparatus includes: a laser oscillator configured to oscillate a laser pulse; a first laser deflection unit configured to deflect the laser pulse emitted from the laser oscillator in a two-dimensional direction; a second laser deflection unit having a slower operation speed and configured to deflect the laser pulse emitted from the first laser deflection unit in a two-dimensional direction on a same plane; a laser oscillation control unit configured to control the laser oscillator; and first and second laser deflection control units respectively configured to control operations of the first and second laser deflection units. The first laser deflection control unit controls the first laser deflection unit to successively irradiate the laser pulse to multiple sites along a predetermined track in each of the processing positions in turn, and to change energy of the laser pulse emitted therefrom in a middle of repeated irradiation.

A laser etching apparatus includes a light source to emit a first laser beam having a first energy profile; and a scanner to radiate a second laser beam upon an object along a circular path, the second laser beam having a second energy profile different from the first energy profile.

A laser machining system includes: a robot with a laser cutting head having a plurality of degrees of freedom of motion at least in a two-dimensional plane; and a laser oscillation device configured to transmit laser light to the laser cutting head, the laser machining system being configured to cut a target object into a desired cutting shape by moving the laser cutting head, and further includes a controller configured to perform: a step of moving the laser cutting head along an arc-shaped path to cause laser light irradiation to move from an operation start point to a target-path-cutting start point, the operation start point being determined on a coordinate plane that defines the cutting shape, the target-path-cutting start point being located along the cutting shape (S7); a step of moving the laser cutting head to cause laser light irradiation to move from the target-path-cutting start point to a target-path-cutting end point located along the cutting shape (S8); and a step of moving the laser cutting head along an arc-shaped path to cause laser light irradiation to move from the target-path operation end point to an operation end point (S9).

A laser machine comprises: a head including optical parts allowing reflection of a laser beam or allowing the laser beam to pass through, while being rotatable about rotary axes, and a focusing optical system that focuses the laser beam; a moving mechanism that allows the head and a target to move relative to each other; and a control unit that controls rotations of the optical parts in such a manner that an irradiation intended position to be reached by an emission optical axis when the laser beam is emitted to the target moves in a curvilinear pattern or a linear pattern, controls movement by the moving mechanism so as to move the head and the target relative to each other, and controls emission output from the laser source so as to change a condition for emitting the laser beam based on the rotation angles of the optical parts.

A laser machine comprises: a head including optical parts allowing reflection of a laser beam or allowing the laser beam to pass through, while being rotatable about rotary axes, and a focusing optical system that focuses the laser beam; a moving mechanism that allows the head and a target to move relative to each other; and a control unit that controls rotations of the optical parts in such a manner that an irradiation intended position to be reached by an emission optical axis when the laser beam is emitted to the target moves in a curvilinear pattern or a linear pattern, controls movement by the moving mechanism so as to move the head and the target relative to each other, and controls emission output from the laser source so as to change a condition for emitting the laser beam based on the rotation angles of the optical parts.

Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

Embodiments of a method of forming one or more holes in a substrate for use as a process chamber component are provided herein. In some embodiments, a method of forming one or more holes in a substrate for use as a process chamber component include forming the one or more holes in the substrate with one or more laser drills using at least one of a percussion drilling, a trepanning, or an ablation process, wherein each of the one or more holes have an aspect ratio of about 1:1 to about 50:1, and wherein the substrate is a component for gas delivery or fluid delivery.

A method of processing a metal-ceramic substrate (1), including providing a metal-ceramic substrate (1), wherein the metal-ceramic substrate (1) comprises at least one metal layer (21) and one ceramic element (11), which extend along a main extension plane (HSE) and are arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (HSE), and forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.