A housing for a control unit of a motor vehicle has a housing element and a further element attached to the housing element by way of a joining technique that does not include a joining layer or by way of a joining layer. The housing element has a main body composed of a light metal and a protective layer applied to the main body. The protective layer is arranged between the main body and the attached further element. The invention further relates to a method for producing a housing and to a control unit.

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

A method of forming a metal bonding layer includes forming first and second bonding metal layers on one surfaces of first and second bonding objects, respectively. The second bonding object is disposed on the first bonding object such that the first bonding metal layer and the second bonding metal layer face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first bonding metal layer and the second bonding metal layer includes an oxidation prevention layer formed on an upper surface thereof. The oxidation prevention layer is formed of a metal having an oxidation reactivity lower than an oxidation reactivity of the bonding metal layer on the upper surface which the oxidation prevention layer is disposed.

A power module has a copper layer composed of copper or a copper alloy on a surface of a circuit layer to which a semiconductor device is bonded, and a solder layer that is formed by using a solder material is formed between the circuit layer and the semiconductor device. An average crystal grain size which is measured by EBSD measurement in a region having a thickness of up to 30 m from the surface of the circuit layer in the solder layer is 10 m or less, the solder layer has a composition that contains Sn as a main component, 0.01 to 1.0% by mass of Ni, and 0.1 to 5.0% by mass of Cu, and a thermal resistance increase rate when a power cycle is loaded 100,000 times is less than 10% in a power cycle test.

A suppressor having a body and a first connector half coupled to the body, wherein the first connector half includes a first component that includes at least one channel and a first surface; and wherein the body provides a second surface, wherein a gap between the first surface and the second surface defines at least one track; wherein the gun includes a second connector half comprising at least one protrusion, wherein the protrusion and channel have corresponding shapes that allow the protrusion to be inserted through the channel and into alignment with the track, wherein the first component may be rotated with respect to the protrusion and the body to bring the protrusion out of alignment with the channel so that the first and second surfaces clamp the protrusion to thereby secure the first connector half and second connector half with respect to each other.

A welding consumable includes a metallic core, and a flux coating surrounding a portion of the metallic core. The flux coating includes a reduced manganese content, which results in a significant reduction of manganese in the weld fumes formed when the welding consumable is consumed in an arc welding process.

The present invention relates to a filler metal used in welding of a metal material comprises a number of line material groups in various arrangements in a manner that a parent material is rolled onto a flat plate of below 1 mm in a first rolling process, the rolled plate is cut in a first rolling process to form a diameter of the line material of below 1 mm (<1 mm), a plurality of line materials are cleaned, rolled, heat-processed and cold-worked in turn to form the diameter of several mm<<0.3 mm, a plurality of the line materials are combined with each another in a number of bundle arrangements to form a group, and a number of the line material groups are combined with each another to form a core material and a manufacturing method thereof.

The present disclosure relates to new metal powders for use in additive manufacturing, and aluminum alloy products made from such metal powders via additive manufacturing. The composition(s) and/or physical properties of the metal powders may be tailored. In turn, additive manufacturing may be used to produce a tailored aluminum alloy product.

A suppressor having a body and a first connector half coupled to the body, wherein the first connector half includes a first component that includes at least one channel and a first surface; and wherein the body provides a second surface, wherein a gap between the first surface and the second surface defines at least one track; wherein the gun includes a second connector half comprising at least one protrusion, wherein the protrusion and channel have corresponding shapes that allow the protrusion to be inserted through the channel and into alignment with the track, wherein the first component may be rotated with respect to the protrusion and the body to bring the protrusion out of alignment with the channel so that the first and second surfaces clamp the protrusion to thereby secure the first connector half and second connector half with respect to each other.