A window glass structure according to one aspect of the present invention includes a window glass for a vehicle that has a surface provided with a conductive layer having a predetermined pattern, and a connection terminal that is soldered to the conductive layer. The connection terminal includes a first joining portion that is joined to the conductive layer by soldering using a lead-free solder, a first side plate that is linked to the first joining portion and extends in a direction of separation from the surface of the window glass, a second joining portion that is joined to the conductive layer by soldering using a lead-free solder, a second side plate that is linked to the second joining portion and extends in a direction of separation from the surface of the window glass, a bridge portion that extends so as to link the two side plates, and a terminal portion configured to be linked to the bridge portion so as to have a face that is oriented in a direction different from directions in which faces of the two side plates and the bridge portion are oriented, at a position separated from regions to which the first side plate and the second side plate are linked.

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

A method for reducing a process time for soldering electrical or electronic components by electromagnetic induction heating, in particular soldering electrical contact elements with solder connection surfaces which are applied to a non-metallic substrate, in particular a glass pane, the method comprising the steps providing an electrical contact element configured as a solder base and made from an iron nickel or iron chromium alloy material; applying a lead free connection material to the soldering base, wherein the connection material or the solder is made from a lead free material, in particular Bi.sub.57Sn.sub.42Ag.sub.1, Bi.sub.57Sn.sub.40Ag.sub.3, SAg.sub.3.8Cu.sub.0.7 or Sn.sub.55Bi.sub.44Ag.sub.1; positioning the soldering base on the respective solder contact surface; inductive heating of the solder base by high frequency energy with increased heating of the solder base material and reduced heating of the material of the respective solder connection surface; and completing the soldering step after a time period of less than or equal to 10 seconds, advantageously 4 to 6 seconds. The invention also relates to a contact element configured as a particular soldering base.

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag.sub.2O in terms of oxides and the glass transition point is 180° C. or less.

Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0<[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0<[Cu]<0.5, In in a range of 5.2+(6−(1.55×[Cu]+4.428))≦[In]≦6.8 when [Cu] falls within a range of 0.5≦[Cu]≦1.0, In in a range of 5.2≦[In]≦6.8 when [Cu] falls within a range of 1.0<[Cu]≦1.2. A balance includes only not less than 87 mass % of Sn.

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

Aiming at providing a metal particle, an electro-conductive paste, a formed article, and a laminated article that are able to form a highly reliable and high-quality electric interconnect, an electro-conductive bonding portion, or a three-dimensional structure that is less likely to produce the Kirkendall void, this invention discloses a metal particle which include an outer shell and a core part, the outer shell including an intermetallic compound and covering the core part.

A solder alloy contains 0.5 mass % or more and 1.25 mass % or less of Sb, In which satisfies 5.5≦[In]≦5.50+1.06[Sb] in a case of 0.5≦[Sb]≦1.0; and 5.5≦[In]≦6.35+0.212[Sb] in a case of 1.0<[Sb]≦1.25 (in the expression, [Sb] indicates the Sb content percentage (mass %) and [In] indicates the In content percentage (mass %)), 0.5 mass % or more and 1.2 mass % or less of Cu, 0.1 mass % or more and 3.0 mass % or less of Bi, and 1.0 mass % or more and 4.0 mass % or less of Ag. The remainder is formed from Sn.