An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.

The present disclosure relates generally to an improved design of a metal-cored welding wire electrode for use on a high deposition rate welding process that resistively preheats the wire prior to being subjected to the welding current. The preheat circuit reduces the welding current drawn by the electrode so that higher wire feed speeds, and thus higher deposition rates, may be obtained. The metal-cored welding wire includes both a higher fill rate (a greater percentage of the welding wire is the granular core) along with added sulfur and an added bead wetting agent. The bead wetting agent may be one or more of selenium, tellurium, arsenic, gallium, bismuth, and tin. The improved metal-cored welding wire leads to an enhanced weld deposit appearance that means the weld deposits are less likely to be rejected as unusable.

A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.

A solder supplying method for maintaining the Bi content contained in a solder alloy in a solder bath at a predetermined amount even after soldering a large number of printed circuit boards with a Bi-containing solder alloy. A solder supplying method includes supplying an additionally supplied solder, which is Sn and/or a low-Bi solder alloy having a lower Bi content than a Bi-containing solder alloy, to a solder bath into which the Bi-containing solder alloy has been introduced, thereby adjusting the Bi content in the solder bath to the Bi content of the Bi-containing solder alloy when it has been initially introduced in the solder bath.

Undercooled liquid metallic core-shell particles, whose core is stable against solidification at ambient conditions, i.e. under near ambient temperature and pressure conditions, are used to join or repair metallic non-particulate components. The undercooled-shell particles in the form of nano-size or micro-size particles comprise an undercooled stable liquid metallic core encapsulated inside an outer shell, which can comprise an oxide or other stabilizer shell typically formed in-situ on the undercooled liquid metallic core. The shell is ruptured to release the liquid phase core material to join or repair a component(s).

A flux containing an organic acid, an acrylic resin, a rosin, a thixotropic agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid, and the content of the 1,2,3-propanetricarboxylic acid is 0.1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced, temperature cycle reliability is excellent, and scattering due to heating during reflow can be suppressed.

A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.

A flux according to the present invention contains rosin, a polymer (P) having a repeating unit represented by General Formula (p1), a solvent, a thixotropic agent containing polyamide, a specific dicarboxylic acid, and a specific compound having a benzotriazole skeleton. In General Formula (p1), R.sup.1 represents a methyl group or a hydrogen atom. R.sup.2 represents a hydrocarbon group having 1 or 2 carbon atoms or a hydrogen atom. According to such a flux, the cohesiveness of the solder alloy powder is high during reflow, the blackening of flux residue is suppressed, and the precipitation with time is unlikely to occur, and the favorable temporal stability can be provided.

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The present disclosure relates generally to an improved design of a metal-cored welding wire electrode for use on a high deposition rate welding process that resistively preheats the wire prior to being subjected to the welding current. The preheat circuit reduces the welding current drawn by the electrode so that higher wire feed speeds, and thus higher deposition rates, may be obtained. The metal-cored welding wire includes both a higher fill rate (a greater percentage of the welding wire is the granular core) along with added sulfur and an added bead wetting agent. The bead wetting agent may be one or more of selenium, tellurium, arsenic, gallium, bismuth, and tin. The improved metal-cored welding wire leads to an enhanced weld deposit appearance that means the weld deposits are less likely to be rejected as unusable.