A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

Metal compositions and production processes are described. A process for the production of a metal composition includes a first distillation step separating off by evaporation primarily lead from a solder mixture of lead, tin, and antimony, thereby producing as a first concentrated lead stream. The process includes a second distillation step separating primarily lead and antimony from the metal composition, thereby producing a second concentrated lead stream and a second bottom product. The method also includes a third distillation step separating primarily lead and antimony from the second concentrated lead stream, thereby producing a third concentrated lead stream and a third bottom product.

A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

A solder composition comprising a material in a first phase (e.g., liquid and/or solid phase) with a transition temperature is provided. Exposure of the solder to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change from the first phase to a gaseous phase. The phase change physically transforms the solder material.

Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.

A front electrode for a solar cell includes a substrate, a first conductive layer on the substrate, and a second conductive layer on the first conductive layer. The second conductive layer is formed of a composition including silver powder as a first metal powder; and at least one of tin powder, lead powder, and bismuth powder as a second metal powder. The second metal powder is present in an amount of about 0.1 wt % to about 15 wt % based on the total weight of the first conductive layer and the second conductive layer in an unbaked state of the first conductive layer and the second conductive layer.

A method for eutectic alloy bonding of foreign parts during the additive manufacturing process includes the following steps: designing a component for additive manufacturing printing which will include a foreign part such that the foreign part is bonded to the component via an eutectic alloy solder and disposed within a recess; starting to print the component using an additive manufacturing printer; stopping the additive manufacturing printer at the point where the foreign part and the eutectic alloy solder will be placed; placing the foreign part and solder into the recess; restarting the additive manufacturing printer such that the component is completed; and, heat treating the component such that the eutectic alloy solder forms a secure bond between the foreign part and the completed component.

[Problem] Even if heat cycles are applied, degradation of joint strength is restrained. [Solution to problem] Lead solder joint structure, in which a first member is joined to a second member using lead solder, the structure comprising: a first solder layer that includes the first member as a core; a second solder layer that exists between the first solder layer and the second member and joins the first solder layer and the second member together; and a third solder layer that exists between the second solder layer and the second member.

Provided are an ultrasonic probe and a method of manufacturing the same. The ultrasonic probe includes: a first unit configured to generate an ultrasonic wave from a first electrical signal or generate a second electrical signal from an echo signal of the ultrasonic wave; a second unit configured to provide the first electrical signal to the first unit or receive the second electrical signal from the first unit; and a third unit configured to electrically connect the first unit to the second unit, the third unit comprising a plurality of conductive bumps spaced apart from one another and a non-conductive paste or film that surrounds the plurality of conductive bumps.

Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.