A heat-exchanger tube has a tube main body composed of an aluminum alloy. A coating is applied onto a surface of the tube main body. The coating contains a powder mixturewhich includes: 1 g/m.sup.2 or more and 7 g/m.sup.2 or less of an Si powder, 0.2 g/m.sup.2 or more and 4.0 g/m.sup.2 or less of a Zn powder, 0.5 g/m.sup.2 or more and 5.0 g/m.sup.2 or less of a first flux powder composed of a compound that contains Zn, and 5 g/m.sup.2 or more and 20 g/m.sup.2 or less of a second flux powder composed of a compound that does not contain Znand a binder. The total amount of the powder mixture in the coating is 30 g/m.sup.2 or less. The proportion of the binder in the coating is 5-40 mass %.

The present invention relates to an electric component comprising a main body, a terminal electrode on at least one side of the main body and a hot-melt polymer layer on the terminal electrode, wherein the hot-melt polymer layer comprises a metal powder, a polymer and a wax.

The present disclosure provides compositions and methods for forming three-dimensional structures atop substrates. These structures may be formed and processed so as to braze together two substrates. The structures may be controllably formed in three dimensions so as to accommodate virtually any substrate geometry or configuration. The structures may also be disposed so as to maintain spacing between two surfaces.

A method of forming a metal bonding layer includes forming first and second bonding metal layers on one surfaces of first and second bonding objects, respectively. The second bonding object is disposed on the first bonding object such that the first bonding metal layer and the second bonding metal layer face each other. A eutectic metal bonding layer is formed through a reaction between the first and second bonding metal layers. At least one of the first bonding metal layer and the second bonding metal layer includes an oxidation prevention layer formed on an upper surface thereof. The oxidation prevention layer is formed of a metal having an oxidation reactivity lower than an oxidation reactivity of the bonding metal layer on the upper surface which the oxidation prevention layer is disposed.

A shaped, small diameter brazing preform is disclosed. The preform, with a cross-sectional diameter between 0.04 inches and 0.08 inches, comprises a continuous, uniform, cavity in a center of the preform extending along, a length formed by three distinct and generally planar sides of the preform. An opening to the cavity along at least a portion of the cross section creating a gap comprises a flux positively retained within the cavity by a pressure from the three sides. A process of forming the shaped, small diameter brazing preform comprises a generally flat, and planar sheet metal section. A plurality of rollers, each one having a unique surface profile, forms the sheet metal section such that the sheet metal section is formed into a generally triangular shaped preform. The cavity is stuffed with a flux, which is exposed to an exterior of the cavity along the length of the preform.

A laser guided nano-brazing method for a reinforced aluminum composite material having high volume fraction silicon carbide particles, comprising 4 steps: nanocrystallizing the surface of the reinforced aluminum composite material having high volume fraction silicon carbide particles, preparing solder material, assembling pieces to be soldered, and dual-beam laser brazing. The use of nano-technology for the brazing of reinforced aluminum composite material having high volume fraction silicon carbide particles, and the use of dual-beam laser technology for brazing temperature field control enhance the humidity during the brazing process of said material and filling ability of the solder material, and satisfy the strict requirements of electronic packaging.

Using flux to suppress increase in the viscosity of solder paste during its storage and also to improve the fusibility of a solder alloy. The flux, which contains an activator and a solvent, forms solder paste by being mixed with a granular solder alloy. The flux contains a monoalkyl propylene glycol-based solvent. It is preferable that the monoalkyl propylene glycol-based solvent is butyl propylene triglycol or butyl propylene diglycol. It is also preferable that the amount of monoalkyl propylene glycol-based solvent is equal to or more than 75 percent by mass but less than 100 percent by mass of the amount of all the solvents.

The present invention describes a brazing process in copper and steel parts for several equipment, using a zinc alloy as an additive material, and a device produced according do said process. Specifically, the present invention includes a brazing process between a copper pipe and a steel part, using an alloy composed mainly by zinc as addiction material. Said brazing process is applied to exhaust copper pipes and steel exhaust system, both present in the compressors. The present invention is situated on the industrial field of compressors, metallurgy, mechanical engineering and materials engineering.

The present invention provides a coated solder material that is capable of preventing the advancement of oxidation of the surface during long-term storage and when melted, and that has excellent wetting extendability and bondability, without the occurrence of gaps in the bonded areas. A coating film is formed on the surface of a solder material; the coating film including a carbon compound that is formed by introducing an organic compound having a carbon number of 8 or less together with a carrier gas into a reaction gas that has been plasmatized under atmospheric pressure, and after a radicalized organic compound has been formed by radicalizing the organic compound, causing the radicalized organic compound to react with the metal on the surface of the solder material; the thickness of the coating film is 4 nm to 200 nm, and when heated at 150 C. to 300 C. and melted, the mass-reduction rate is 60% or greater.

Method and apparatus for establishing an electrical interconnection between an electrical lead and a printed circuit board (PCB), such as a PCB used in a data storage device. In some embodiments, the PCB includes a multi-layer substrate having at least one conductive layer and at least one electrically insulative layer. An electrically conductive pad is provided on a facing surface of the substrate in electrical communication with the at least one conductive layer. A flux reservoir is placed adjacent the pad which extends from the facing surface into the substrate. A solder mask layer is provided on the facing surface of the base structure which surrounds the pad and extends into the reservoir. The solder mask layer and reservoir collect liquid flux from a soldering operation used to form a solder joint between the pad and a conductive lead of an electronic component.