A ceramic copper circuit board including a ceramic substrate, and a copper circuit part located on the ceramic substrate, wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part parallel to the first direction crosses multiple copper crystal grains, the first direction is from the ceramic substrate toward the copper circuit part, an average of multiple distances in a second direction between the line and edges of the copper crystal grains is not more than 300 μm, and the second direction is perpendicular to the first direction.

The present disclosure provides a welding electrode and methods of manufacturing the same. The welding electrode can include a composite body having a tip portion and an end portion. The composite body can include a shell defining a cavity through the end portion, the shell comprising a first metal that includes one or more of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The composite body can also include a core within the shell, the core extending through the shell from the tip portion to the cavity, the core comprising a second metal that includes dispersion strengthened copper. The core and the shell have a metallurgical bond formed from co-extrusion.

The present disclosure provides a method of manufacturing a composite material. The method can include compacting a copper alloy powder into a plurality of substantially uniform compressed sub-assemblies such that the copper alloy powder has a density that is greater than 50%. The plurality of compressed sub-assemblies can be layered relative one another within an aperture of a shell, the plurality of compressed sub-assemblies to form a consecutive assembly of compacted copper alloy. The shell may include one of the following: a precipitation hardened copper alloy, copper alloy, and carbon steel. The consecutive assembly can be sealed within the shell to form a billet. The billet can be hot-extruded to form a rod, and the extruded rod can be further drawn to form a composite wire of a desired diameter. The composite wire may be used to create a composite welding electrode.

A guide hole is constituted of a large-diameter hole, a medium-diameter hole, and a small-diameter hole. A sliding part fitted in the guide hole is formed of a synthetic resin material. A large-diameter portion of the sliding part is fitted in the large-diameter hole in a slidable state, and a medium-diameter portion is fitted in the medium-diameter hole in a slidable state. A movable end surface of the sliding part is in close contact with a stationary inner end surface of the guide hole. By configuring a width dimension of the movable end surface to be less than half of a thickness dimension of the large-diameter portion, a pressurizing force of the movable end surface is increased and a minute metal piece is pushed from the movable end surface into a base material of the sliding part, and a thickness dimension of the medium-diameter portion is set large.

A method for manufacturing a pressure measuring cell, which has a ceramic platform and a ceramic measuring membrane, wherein the measuring membrane is joined with the platform pressure tightly by an active hard solder, or braze, wherein the method includes: providing the platform, the measuring membrane and the active hard solder, or braze, positioning the active hard solder, or braze, between the platform and the measuring membrane; melting the active hard solder, or braze, by irradiating the active hard solder, or braze, by a laser, wherein the irradiating of the active hard solder, or braze, occurs through the measuring membrane; and letting the active hard solder, or braze, solidify by cooling.

The invention relates to a paste, preferably for joining components of power electronics modules, the paste comprising a solder powder, a metal powder and a binder, wherein the binder binds solder powder and metal powder before a first heating. According to the invention, the binder is free of flux or is a flux having only low activation. In this way, a joining layer which exhibits only few included voids and good mechanical and electrical stability can be provided between a first and a second component.

A secondary cell manufacturing method includes placing a current collector terminal on a plurality of laminated current collector foils from a lamination direction of the current collector foils. The current collector terminal has a first end portion, and a second end portion forming a cutout with the first end portion. The second end portion includes a base part, and a thin-walled part having a smaller thickness than the base part. The secondary cell manufacturing method includes welding the plurality of current collector foils to the current collector terminal by scanning the plurality of current collector foils disposed in the cutout with a laser beam along the first extension direction toward the second end portion while irradiating the plurality of current collector foils with the laser beam.

Provided is a bonding wire capable of reducing the occurrence of defective loops. The bonding wire includes: a core material which contains more than 50 mol % of a metal M; an intermediate layer which is formed over the surface of the core material and made of Ni, Pd, the metal M, and unavoidable impurities, and in which the concentration of the Ni is 15 to 80 mol %; and a coating layer formed over the intermediate layer and made of Ni, Pd and unavoidable impurities. The concentration of the Pd in the coating layer is 50 to 100 mol %. The metal M is Cu or Ag, and the concentration of Ni in the coating layer is lower than the concentration of Ni in the intermediate layer.

In a lead-free solder bump, diffusion of Cu from intermetallic compound layers, which are respectively formed at joining interfaces with Cu electrodes is suppressed, so that the in metallic compound layers are not likely to disappear. Correspondingly, with the use of the intermetallic compound layers, Cu is not likely to diffuse from the Cu electrodes into the lead-free solder bump. Even when an electric current flows continuously between a first electronic member and a second electronic member through the lead-free solder bump, the occurrences of the electromigration phemenon and the thermomigration phenomenon are suppressed. Thus, the present invention provides a lead-free solder bump joining structure capable of suppressing the disconnection failure caused by the synergistic effect of the electromigration phenomenon and the thermomigration phenomenon.

A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ≦500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.