Patent classifications
B23K35/3033
Hybrid article, method for forming hybrid article and method for welding
A hybrid article is disclosed including a sintered coating disposed on and circumscribing the lateral surface of a core having a core material and a greater density than the sintered coating. The sintered coating includes more than about 95% up to about 99.5% of a first metallic particulate material including a first melting point, and from about 0.5% up to about 5% of a second metallic particulate material having a second melting point lower than the first melting point. A method for forming the hybrid article is disclosed including disposing the core in a die, introducing a slurry having the metallic particulate materials into a gap between the lateral surface and the die, and sintering the slurry. A method for welding a workpiece is disclosed including the hybrid article serving as a weld filler.
Ni-Based Superalloy Powder for Additive Manufacturing and an Article Made Therefrom
A nickel base superalloy powder for additive manufacturing applications is disclosed. The alloy powder has the following broad weight percent composition:
TABLE-US-00001 C .sup. 0-0.1 Mn 0.5 max. Si 0-0.03 Cr 4-16 Fe .sup. 0-1.5 Mo 0-6 W 0-8 Co 0-15 Ti 0-2 Al 0.5-5.5 Nb 0-6 Ta 7.5-14.5 Hf .sup. 0-2.0 Zr .sup. 0-0.1 Re 0-6 Ru 0-3 B 0-0.03
The balance of the alloy is at least 50% nickel and the usual impurities. An article of manufacture made from the alloy is also disclosed.
ABRASIVE COATING INCLUDING METAL MATRIX AND CERAMIC PARTICLES
A system may include an energy delivery device and a computing device. The computing device may be configured to: control the energy delivery device to deliver energy to an abrasive coating, wherein the abrasive coating comprises a metal matrix and abrasive particles at least partially encapsulated by the metal matrix; and control the energy delivery device to scan the energy across a surface of the abrasive coating and form a series of softened or melted portions of the metal matrix.
Solder Material, Layer Structure, Chip Package, Method of Forming a Layer Structure, Method of Forming a Chip Package, Chip Arrangement, and Method of Forming a Chip Arrangement
A solder material may include nickel and tin. The nickel may include first and second amounts of particles. A sum of the particle amounts is a total amount of nickel or less. The first amount is between 5 at % and 60 at % of the total amount of nickel. The second amount is between 10 at % and 95 at % of the total amount of nickel. The particles of the first amount have a first size distribution, the particles of the second amount have a second size distribution, 30% to 70% of the first amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the first size distribution, and 30% to 70% of the second amount have a particle size in a range of about 5 μm around a particle size the highest number of particles have according to the second size distribution.
MULTI COMPONENT SOLID SOLUTION HIGH-ENTROPY ALLOYS
A multi-material component joined by a high entropy alloy is provided, as well as methods
Coated gas turbine engine components
A gas turbine engine component may include a coating adapted to protect the component during use. The coating may be applied by sintering metallic particles to form a metallic matrix fused to the component.
Particles, connecting material and connection structure
Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 μm or more and 15 μm or less, the particles have a 10% K value of 30 N/mm.sup.2 or more and 3000 N/mm.sup.2 or less, and the particles have a particle diameter CV value of 50% or less.
Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using Same
A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.
METHOD OF BONDING METAL MEMBERS AND METAL MEMBER JOINT BODY
A method of bonding metal members includes a stacked body forming step of forming a stacked body by putting an insert material between a first metal member and a second metal member formed of carbide-containing Ni alloys or carbide-containing Fe alloys, and a solid phase diffusion bonding step of forming a metal member joint body by heating and pressurizing the stacked body to perform solid phase diffusion bonding, wherein the insert material contains Ni having a content higher than an Ni content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Ni alloys, and contains Fe or Ni having a content higher than an Fe content of the first metal member and the second metal member when the first metal member and the second metal member are formed of the carbide-containing Fe alloys.
METHOD OF PREPARING A SURFACE FOR DIFFUSION BONDING AND METHOD OF DIFFUSION BONDING
A method of preparing a surface for diffusion bonding comprises contacting a binder material with a discontinuous surface comprising surface regions separated by gaps. The binder material is selectively deposited onto the surface regions and has a sufficient viscosity to form a self-supporting layer without flowing into the gaps. The self-supporting layer of binder material comprises a mass density in a range from about 0.001 g/in.sup.2 to about 0.050 g/in.sup.2. A braze powder is distributed over the self-supporting layer of binder material, and a predetermined amount of the braze powder is attached to the binder material. The discontinuous surface is then heated to remove the binder material and adhere the braze powder to the discontinuous surface. Thus, a prewet surface with a braze deposit thereon is formed.