In a battery case sealing method, a lid is fitted to an opening of a battery case, and then a side wall on an inner side of the battery case and a side surface of the lid are brought into contact with each other. The side wall forms the opening. In a state where the side wall on the inner side of the battery case is in contact with the side surface of the lid, a boundary portion between the side wall and the side surface of the lid is welded by irradiating a laser beam in a direction from an outer side of the battery case toward the inner side of the battery case in a thickness direction of the lid.

A spacer grid welding fixture comprises a frame sized to receive an assembled spacer grid comprising a first set of parallel straps and a second set of parallel straps oriented orthogonally to the first set of parallel straps, the first and second sets of parallel straps interlocked together by slots cut into the straps. A first set of grid engagement bars is placed on a first side of the spacer grid with each grid engagement bar arranged parallel with the straps of the first set of parallel straps and engaging the straps of the second set of parallel straps. A second set of grid engagement bars is placed on an opposite second side of the spacer grid with each grid engagement bar arranged parallel with the straps of the second set of parallel straps and engaging the straps of the first set of parallel straps.

Systems and methods are provided for fixturing hairpins for joining by welding. A fixture system includes an outer structural ring fixed relative to an inner structural ring and mates with the component around its hairpin type conductor ends. Dielectric rings are disposed between conductor pairs. Clamp rings are disposed on opposite sides of the dielectric rings. One clamp ring and one dielectric ring define an opening receiving one conductor pair. Another clamp ring and another dielectric ring define another receiving another conductor pair. The clamp rings are movable toward one another to align and crowd the conductor pairs between the clamp rings and the dielectric rings prior to welding.

A heat exchanger brazing fixture including a baseplate including a first surface and a second surface located opposite the first surface and a first post including a first end and a second end located opposite the first end. The first post is operably associated with the first surface of the baseplate at the first end. The A heat exchanger brazing fixture further including a top plate operably connected to the first post and separated from the first surface of the baseplate by a selected distance. The top plate being configured to move in a first direction along the first post when a heat exchanger resting upon the first surface of the baseplate expands during a brazing process.

An electric wire arranging jig (40) has an electric wire arranging groove (16, 31, 41) configured to be inserted the electric wires. The electric wire arranging groove has a pair of arranging surfaces facing each other. The electric wire arranging groove is configured to have a cross-sectional shape, in a section perpendicular to a direction of the electric wires extending within the electric wire arranging groove, having a distance in a width direction of the electric wire arranging groove continuously narrowed from an insertion start portion for the electric wires toward a bottom portion of the electric wire arranging groove and the arranging surfaces each inclining from a vertical direction, at least in a part of a segment between the insertion start portion and the bottom portion.

A device is used for forming a part by welding a plurality of members together, and includes a jig on one side having a joint face on one side, which is adapted to contact one of faces exposed on the outer surface sides of the plurality of members overlaid one on top of the other, and an opening on one side corresponding to a portion of desired welded portions of the part; a jig on another side having a joint face on the other side, which is adapted to contact another face of the faces exposed on the outer surface sides of the plurality of members, and an opening on the other side corresponding to another portion of the desired welded portions of the part and not corresponding to the opening on one side; a laser welding machine on one side that is configured to emit a laser beam toward the opening on one side; and a laser welding machine on the other side that is configured to emit a laser beam toward the opening on the other side.

The invention relates to tooling for holding parts in position to enable them to be friction welded together in order to construct a hollow structure, the tooling comprises: a framework made up of two frames for receiving the parts for welding together in their positions for forming the hollow structure, the parts comprising preformed parts and an intermediate section; shape-holder members for holding the hollow structure, associating backing thrust members and lateral grip members for gripping the outsides of the preformed parts; anvils suitable for being placed inside the set of preformed parts beside the section; and clamping means operable to take up a clamping position in which they cause opposing thrust to be applied against the anvil and the inside face of a preformed part, its part itself bears against the shape-holder members.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.