There is provided an adjustable part holding fixture, system and method. The fixture has a base assembly with a container and a phase change material contained within the container. The fixture has a control device to convert the phase change material between a non-rigid state and a rigid state. The fixture has a plurality of part holding assemblies, each having a base anchoring portion for insertion into and positioning in the phase change material, and a part attachment portion configured to releasably attach to a surface of a part being held by the fixture. The phase change material in the non-rigid state allows for positioning of the base anchoring portion and adjusting to the part being held, and the phase change material in the rigid state holds the base anchoring portion in a desired position and holds the part in place during one or more processes performed on the part.

A holding device (1) holds a lens (6) at its lens edge (5) with the aid of an adhesive connection (16, 17). The adhesive connection (16, 17) is applied only at one adhesive point or only at two spaced apart adhesive points (16, 17). Each holding device (1) provided with a lens (6) is positioned on the dip frame in such a manner that the lens (6) is positioned above its holding device (1). A method is provided for finishing lenses (6) wherein the lenses (6) are subjected to various sequential finishing steps of a finishing process and the lenses (6) are cemented to the same holding device during finishing. The application of adhesive is only at one adhesive point or at two spaced apart adhesive points (16, 17).

A holding device (100) for a round dental blank (200). The holding device has an open ring element (101) for laterally gripping the dental blank (200) and a closing element (103) for closing the ring element (101) at various positions.

A tooling fixture assembly for processing a component of a gas turbine engine is provided. The tooling fixture assembly includes a component nesting fixture for precisely positioning the component within the fixture using a plurality of datum locators. A transfer block is also positioned at a known location and orientation relative to the component and an adhesive is used to fix the relative position of the component and the transfer block. The component and the transfer block are then removed from the component nesting fixture and installed on a machine for drilling, machining, or otherwise processing the component. After the machining is complete, the adhesive may be removed, such that the component may be detached from the transfer block.

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

A method of allowing a work-piece to obtain its free state shape while bonded to an adhesive fixture includes allowing the fixing surfaces to change shape or position relative to a fixture base without degrading the holding strength of the adhesive joints. A floating adhesive fixture may use one or more floating adhesive fixture devices. Each device includes a fixture element with an integral fixing surface that can displace relative to the fixture, a clamping system that can release or prevent this motion, and a suspension that keeps the fixture element in a nominal position when the clamping system is disengaged. A method includes unclamping the fixture elements and allowing them to displace as the adhesive joints and work-piece reduce strain energy. The clamping of the fixture elements prepares the fixture for the ensuing manufacturing process.

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

A method of supporting a workpiece on a fixture, the workpiece having a first surface and an opposite second surface, and an aperture positioned at a center of the first surface and extending from the first surface to the second surface the fixture having a first end, an opposite second end, and a center portion, the center portion comprising a supporting surface, the second end being adapted to be mounted in a lathe, the supporting surface comprising an annular recess, the annular recess accommodating a supporting medium, the second surface of the workpiece being in intimate contact with the supporting medium, the method comprising the steps of: (i) mounting the fixture in the lathe; (ii) locating the aperture on the first end of the fixture; and (iii) securing the workpiece on the fixture, with the second surface of the workpiece being coplanar with the supporting surface of the fixture.

Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

A spin chuck includes an upper plate having an upper surface and a lower surface, the upper plate including a groove and a support pin on the upper surface of the upper plate, wherein the support pin is configured to support a substrate; an anti-slip plate below the upper plate, the anti-slip plate having an upper surface and a lower surface, wherein the anti-slip plate includes a first protrusion protruding in a vertical direction from the upper surface of the anti-slip plate toward the upper plate; and a lower plate below the anti-slip plate, the lower plate including a chucking pin configured to fix the substrate, wherein the lower plate has an upper surface and a lower surface, wherein the first protrusion of the anti-slip plate is coupled to the groove of the upper plate.