A method of fabricating a grinding tool includes providing an abrasive particle, and cutting the abrasive particle with a laser beam so that the cut abrasive particle has four tips adjacent to one another, a cavity of a generally cross shape extending between the four tips, and a material discharge surface at an end of the cavity. The laser beam is applied along a plurality of parallel first cutting lines and a plurality of parallel second cutting lines, the second cutting lines intersecting the first cutting lines, at least the first cutting lines being grouped into a first, a second and a third region, the second region being located between the first and third regions, a number of cutting passes repeated along each of the first cutting lines in each of the first and third regions increasing as the first cutting line is nearer to the second region, and the laser beam repeating a plurality of cutting passes along each of the first cutting lines in the second region.

Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.

A method for machining a plate-shaped component, in particular an electrostatic holding device or an immersion wafer table, with a surface formed by end faces of protruding burls, including: mutual alignment of the component on a component carrier device and of a mechanical polishing tool on a tool carrier device, wherein the polishing tool and the component are arranged for relative movement to remove material from end face(s) of at least one burl. The polishing tool includes shape-stable, deformable binding agent and polishing particles therein. Pressure force between the polishing tool and the at least one burl is measured by a force sensor device. The tool carrier device and/or the component carrier device are set to a predefined working value of the pressure force such that material is removed from the end face during removal movement. Also disclosed are a plate-shaped component produced with the method, and a polishing device.

An automatic wet sanding apparatus is equipped with a suction unit having a suction nozzle that is located under an automatic wet sanding unit in a state where automatic wet sanding is performed and a suction device that generates a suction force for suctioning water through the suction nozzle, so that water having been used for automatic wet sanding can be suctioned through the suction nozzle. This can significantly reduce the amount of water containing sanding dust that flows down a painted surface under the suction nozzle, and thereby reduce the amount of sanding dust that remains on the painted surface after completion of automatic wet sanding. As a result, it is possible to achieve a quality finish on the painted surface while eliminating the need for the troublesome task of wiping off remaining sanding dust.

The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophilic coating, and polishing systems therefrom. The present disclosure provides an abrasive article including a ceramic body having an abrading surface and an opposed second surface, wherein the abrading surface of the ceramic body includes a plurality of engineered features each having a base and a distal end opposite the base and the ceramic body has a Mohs hardness of at least 7.5; a conformable metal oxide coating adjacent to and conforming to the plurality of engineered features, wherein the conformable metal oxide coating includes a first surface; and a conformable polar organic-metallic coating in contact with the first surface of the conformable metal oxide coating, wherein the conformable polar organic-metallic coating includes a chemical compound having at least one metal and an organic moiety having at least one polar functional group.

Embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, a process for preparing the same, and a process for preparing a semiconductor device using the same. According to the embodiments, it is possible to provide a polishing pad in which the average diameter of the plurality of pores contained in the polishing pad, the sphericity of the plurality of pores, and the volume ratio thereof are adjusted, thereby enhancing the polishing speed and reducing surface such defects as scratches and chatter marks appearing on the surface of a semiconductor substrate.

An additive manufacturing apparatus for forming a polishing pad for chemical mechanical polishing includes a platform, an actuator system coupled to the platform to adjust a tilt of the platform, one or more printheads supported above the platform, the one or more printheads configured to dispense successive layers of feed material on the platform to be form the polishing pad, a sensing system to detect a height of a surface on or above the platform at each of a plurality of horizontally spaced points, and a controller configured to selectively operate the actuator system to adjust the tilt of the platform based on the detected height of the platform at each of the points such that the surface is moved closer to horizontal.

Provided is a manufacturing method for a thin phosphor glass plate by which a thin phosphor glass plate can be more certainly produced. A manufacturing method includes the steps of: preparing a phosphor glass base material 21 having a first principal surface 21a and a second principal surface 21b opposed to each other; placing the phosphor glass base material 21 on a stage 22 and fixing the second principal surface 21b onto the stage 22; and polishing the first principal surface 21a of the phosphor glass base material 21 with a polishing member 23 including an abrasive layer 24.

A formulation, system, and method for additive manufacturing of a polishing pad. The formulation includes monomer, dispersant, and nanoparticles. A method of preparing the formulation includes adding a dispersant that is a polyester derivative to monomer, adding metal-oxide nanoparticles to the monomer, and subjecting the monomer having the nanoparticles and dispersant to sonication to disperse the nanoparticles in the monomer.

There is provided a processing apparatus that polishes the back surface side of a wafer on which devices are formed on the front surface side. The processing apparatus includes a chuck table that holds the wafer and rotates and a polishing unit that forms scratches on the back surface side of the wafer while polishing the back surface side of the wafer. The processing apparatus includes also a scratch determining unit that determines whether or not the scratches exist on the back surface side of the wafer polished by the polishing unit and an informing unit that informs that a region in which the scratches do not exist is included in the wafer when a region for which it has been determined that the scratches do not exist by the scratch determining unit is included in the wafer.