Patent classifications
B24D3/10
ABRASIVE-CONTAINING ELEMENT FOR MULTI-ELEMENT ABRASIVE TOOL, ABRASIVE TOOL, AND METHOD FOR MANUFACTURING THE SAME
An abrasive-containing element has at least one pellet provided with an abrasive-containing layer and an abrasive-free layer, and at least one holding member having one end connected with the abrasive-free layer of the pellet and another opposite end introducible into a tool body for connecting the pellet to the tool body, and an abrasive tool has a plurality of such abrasive-containing elements connected to its tool body.
ABRASIVE-CONTAINING ELEMENT FOR MULTI-ELEMENT ABRASIVE TOOL, ABRASIVE TOOL, AND METHOD FOR MANUFACTURING THE SAME
An abrasive-containing element has at least one pellet provided with an abrasive-containing layer and an abrasive-free layer, and at least one holding member having one end connected with the abrasive-free layer of the pellet and another opposite end introducible into a tool body for connecting the pellet to the tool body, and an abrasive tool has a plurality of such abrasive-containing elements connected to its tool body.
PDC cutter with chemical addition for enhanced abrasion resistance
A superabrasive cutter and a method of making the superabrasive cutter are disclosed. The superabrasive cutter may comprise a plurality of polycrystalline superabrasive particles and about 0.01% to about 4% by weight of the superabrasive particles of a dopant as evaluated prior to a high pressure/high temperature process. The dopant may be immiscible with a catalyst for forming the polycrystalline superabrasive particles.
PDC cutter with chemical addition for enhanced abrasion resistance
A superabrasive cutter and a method of making the superabrasive cutter are disclosed. The superabrasive cutter may comprise a plurality of polycrystalline superabrasive particles and about 0.01% to about 4% by weight of the superabrasive particles of a dopant as evaluated prior to a high pressure/high temperature process. The dopant may be immiscible with a catalyst for forming the polycrystalline superabrasive particles.
PROCESS FOR MAKING A DIAMOND TOOL
Disclosed is a process for making a diamond tool for processing ceramic starting from a mixture of aluminum-based powders in order to obtain a grinding wheel for an eco-friendly squaring of ceramic.
POLYCRYSTALLINE DIAMOND, POLYCRYSTALLINE DIAMOND COMPACTS, METHODS OF MAKING SAME, AND APPLICATIONS
Embodiments of the invention relate to polycrystalline diamond compacts (PDC) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, a PDC includes a polycrystalline diamond (PCD) table bonded to a substrate. At least a portion of the PCD table includes a plurality of diamond grains defining a plurality of interstitial regions. The plurality of interstitial regions includes a metal-solvent catalyst. The plurality of diamond grains exhibit an average grain size of about 30 m or less. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit an average electrical conductivity of less than about 1200 S/m. Other embodiments are directed to PCD, employing such PCD, methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.
POLYCRYSTALLINE DIAMOND, POLYCRYSTALLINE DIAMOND COMPACTS, METHODS OF MAKING SAME, AND APPLICATIONS
Embodiments of the invention relate to polycrystalline diamond compacts (PDC) exhibiting enhanced diamond-to-diamond bonding. In an embodiment, a PDC includes a polycrystalline diamond (PCD) table bonded to a substrate. At least a portion of the PCD table includes a plurality of diamond grains defining a plurality of interstitial regions. The plurality of interstitial regions includes a metal-solvent catalyst. The plurality of diamond grains exhibit an average grain size of about 30 m or less. The plurality of diamond grains and the metal-solvent catalyst collectively exhibit an average electrical conductivity of less than about 1200 S/m. Other embodiments are directed to PCD, employing such PCD, methods of forming PCD and PDCs, and various applications for such PCD and PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.
MANUFACTURING METHOD OF DIAMOND POROUS GRINDING BLOCK BASED ON 3D PRINTING AND APPLICATION THEREOF
A manufacturing method of a diamond porous grinding block based on 3D printing. The manufacturing method includes designing a 3D printing model of a grinding block unit cell with an adjustable porosity according to an internal cooling space for abrasive debris required in a grinding process, importing the 3D printing model of the grinding block unit cell into a MAGICS software, filling a frame of a 3D printing model of a diamond porous grinding block with a plurality of 3D printing models of grinding block unit cells; preparing mixed powder of diamond abrasive particles and an aluminum alloy binder as printing powder, performing 3D printing to the 3D printing model of the diamond porous grinding block by an SLM technology to obtain the diamond porous grinding block. The diamond porous grinding block is configured to form a diamond structure grinding disc for grinding a semiconductor substrate.
MANUFACTURING METHOD OF DIAMOND POROUS GRINDING BLOCK BASED ON 3D PRINTING AND APPLICATION THEREOF
A manufacturing method of a diamond porous grinding block based on 3D printing. The manufacturing method includes designing a 3D printing model of a grinding block unit cell with an adjustable porosity according to an internal cooling space for abrasive debris required in a grinding process, importing the 3D printing model of the grinding block unit cell into a MAGICS software, filling a frame of a 3D printing model of a diamond porous grinding block with a plurality of 3D printing models of grinding block unit cells; preparing mixed powder of diamond abrasive particles and an aluminum alloy binder as printing powder, performing 3D printing to the 3D printing model of the diamond porous grinding block by an SLM technology to obtain the diamond porous grinding block. The diamond porous grinding block is configured to form a diamond structure grinding disc for grinding a semiconductor substrate.
Abrasive articles and methods of forming the same
An abrasive article is provided that may include a body. The body may include a bond component and abrasive particles within the bond component. The bond component may include a FeCoCuNiSn based bond material and a performance enhancing material. The performance enhancing material may include hex-boron nitride. The content of the performance enhancing material may be at least about 6 vol. % and not greater than about 14 vol. % for a total volume of the bond component.