Patent classifications
B29C45/372
FLUOROPOLYMER STAMP FABRICATION METHOD
An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.
COSMETIC LIP APPLICATOR
A method of producing a cosmetic applicator via injection molding is described. In the method, a thermoplastic material is introduced into a mold cavity. The mold cavity comprises a surface which engages the thermoplastic material. The surface may provide micro-etched features recessed therein.
THERMOPLASTIC MOULDED PART, METHOD FOR MANUFACTURING SAME, AND DUCT INCORPORATING SAME
The invention relates to a thermoplastic molded part able to constitute a duct of an aerial vehicle or space vehicle, to a method of manufacturing same, and to this duct which comprises said part. For example, provided is a part according to the invention, which has an external surface (2) with symmetry of revolution at least in part, is such that the external surface comprises a multitude of integrally molded depressions (6) which are connected to one another in pairs by crests (7), and that: each of the depressions has a largest transverse dimension D between the adjacently paired crests of between 3 mm and 10 mm, measured in a direction d perpendicular to the crests delimiting each depression, and each of the crests has an apex of transverse width L measured in said direction d, where L<D.
Thermal interface adhesion for transfer molded electronic components
An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.
Production method of mold having recessed pattern, and manufacturing method of pattern sheet
Provided are a production method of a mold having a recessed pattern, and a manufacturing method of a pattern sheet having good accuracy and excellent productivity. The production method of a mold includes: a step of preparing an electroform having a protruding pattern and a mold having a first mold and a second mold forming a cavity; a step of fixing the electroform excluding an end portion of the electroform to the first mold; a clamping step of clamping the electroform excluding the end portion of the electroform and a region of the protruding pattern between the first mold and the second mold to form the cavity; and an injection step of filling the cavity with a resin.
MOLDING SYSTEMS AND RELATED METHODS
In one embodiment, a system for conditioning a preform for molding includes a heating cavity for receiving the preform, a heater configured to heat a gas, and a blower configured to force the gas heated by the heater into the heating cavity. In another embodiment, a method of conditioning a preform for molding includes positioning the preform in a heating cavity and forcing a heated gas into the heating cavity onto an exterior surface of the preform.
MOLDING SYSTEMS AND RELATED METHODS
A system for molding an object includes an articulated mold having an axis and a plurality of mold portions configured to collectively define a molding cavity for shaping the object when arranged in respective molding positions. The system includes a plurality of actuators, each operatively coupled to a respective mold portion and configured to move the respective mold portion along the axis from the respective molding position toward a respective ejecting position for releasing the object. The system includes a controller in communication with each of the plurality of actuators and configured to independently activate each of the plurality of actuators such that one of the plurality of mold portions moves along the axis from the respective molding position toward the respective ejecting position while at least one other of the plurality of mold portions remains stationary relative to the object in order to at least partially support the object.
MOLDING SYSTEMS AND RELATED METHODS
An actuator system for use in a mold system includes a first actuator operatively coupled to a first mold portion and configured to move the first mold portion along an axis in a first direction from a first molding position toward a first ejecting position. The system also includes a second actuator operatively coupled to a second mold portion and configured to move the second mold portion along the axis in the first direction from a second molding position toward a second ejecting position. The system further includes a controller in communication with the first and second actuators and configured to independently activate the first and second actuators.
Iridescent badges for vehicles
An iridescent vehicle badge (and methods for making it) that includes a translucent, polymeric badge having a non-planar shape and comprising an interior and an exterior surface. Further, at least one of the surfaces of the badge comprises a plurality of diffraction gratings that are integral with the badge, each having a thickness from 250 nm to 1000 nm and a varying period from 50 nm to 5 microns. In some cases, the thickness can range from 500 nm to 750 nm. The period, in some cases, can vary within a set of discrete values in one or more portions of the at least one of the surfaces of the badge, e.g., from 150 nm to 400 nm.
Mold, Method for the Production and Use Thereof, Plastic Film and Plastic Component
The invention relates to a method for creating a surface structure on a mold, wherein first structural elements are created using a laser structuring process in a first step, and second structural elements, which are smaller than the first structural elements, are created using an anodic oxidation process in another step following the laser structuring process. The invention further relates to a mold of said type and finally to a plastic film or a plastic component having a surface structure as well as to a method for the production thereof.