The present disclosure relates to a facility for forming one of a graphene-polymer resin composite and a carbon material-polymer resin composite. According to the facility of the present disclosure, in a process of forming the composite, gas and water vapor contained in graphene, a carbon material, and a polymer resin are effectively removed resulting in an increase in coupling force between the polymer resin and one of the graphene and the carbon material, and the graphene and the carbon material is uniformly dispersed inside the polymer resin resulting in no degradation of physical properties of the composite, and also, the polymer resin may be prevented from carbonizing and solidifying because there is no stagnant section while molten liquid of the polymer resin and one of the graphene and the carbon material passes through each apparatus in the facility, and thus, physical properties of the composite are maintained constant.

An apparatus for molding a part includes a plunger cavity, a plunger, and a mold cavity, wherein the plunger is oriented out-of-plane with respect to a major surface of the mold cavity, and first and second vents couples to respective first and second portions of the mold cavity. In a method, resin and fiber are forced into the mold cavity from a plunger cavity, and at least some of the fibers and resin are preferentially flowed to certain region in the mold cavity via the use of vents.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

An injection molding machine having vent mechanism includes a plastication device, an injection device, a junction, a vent-up sensor, and a controller. The vent-up sensor detects vent-up. When the vent-up is detected, the controller switches from normal conditions to vent-up suppression conditions. The vent-up suppression conditions have at least one of the followings: increasing a rotational speed of the plastication screw to be higher than that in the normal conditions; using retreat-metering when the retreat-metering is not performed in the normal conditions, wherein in the retreat-metering, in addition to a pressure of the resin material, a force in a retreat direction is applied to the injection plunger to move the injection plunger at a predetermined retreat speed in the metering; and increasing the retreat speed of the injection plunger to be higher than that in the normal conditions when the retreat-metering is performed in the normal conditions.

An injection molding machine having vent mechanism includes a plastication device, an injection device, a junction, a vent-up sensor, and a controller. The vent-up sensor detects vent-up. When the vent-up is detected, the controller switches from normal conditions to vent-up suppression conditions. The vent-up suppression conditions have at least one of the followings: increasing a rotational speed of the plastication screw to be higher than that in the normal conditions; using retreat-metering when the retreat-metering is not performed in the normal conditions, wherein in the retreat-metering, in addition to a pressure of the resin material, a force in a retreat direction is applied to the injection plunger to move the injection plunger at a predetermined retreat speed in the metering; and increasing the retreat speed of the injection plunger to be higher than that in the normal conditions when the retreat-metering is performed in the normal conditions.

A molding material supply device and a molding material supply method capable of supplying a degassed molding material to a molding apparatus at a desired timing are desired. According to the molding material supply device and method of the disclosure, a first discharge member is driven to discharge a molding material accommodated in a first accommodation member to a second discharge member through a through hole of a die, and a second discharge member configured by the first accommodation member and the die advances to discharge the molding material having been degassed in the second accommodation member to the molding apparatus from a molding material supply port.

A molding material supply device and a molding material supply method capable of supplying a degassed molding material to a molding apparatus at a desired timing are desired. According to the molding material supply device and method of the disclosure, a first discharge member is driven to discharge a molding material accommodated in a first accommodation member to a second discharge member through a through hole of a die, and a second discharge member configured by the first accommodation member and the die advances to discharge the molding material having been degassed in the second accommodation member to the molding apparatus from a molding material supply port.

A mixing extruder for an injection molding machine includes a barrel unit and an extruder screw. The barrel unit includes an extruder tube. The extruder screw includes a screw rod, a helical mixing channel, and a helical gas flow channel communicating with the helical mixing channel. The helical mixing channel and helical gas flow channel both extend around the screw rod. The helical mixing channel extrudes a paste outwardly from a material discharge opening formed at an end of the extruder tube, whereas the helical gas flow channel connects a suction pump through a gas discharge channel formed in the extruder tube oppositely of the material discharge opening.

A mixing extruder for an injection molding machine includes a barrel unit and an extruder screw. The barrel unit includes an extruder tube. The extruder screw includes a screw rod, a helical mixing channel, and a helical gas flow channel communicating with the helical mixing channel. The helical mixing channel and helical gas flow channel both extend around the screw rod. The helical mixing channel extrudes a paste outwardly from a material discharge opening formed at an end of the extruder tube, whereas the helical gas flow channel connects a suction pump through a gas discharge channel formed in the extruder tube oppositely of the material discharge opening.