An insert changeover system for an injection mold having a releasably secured insert for quick customizations of the injection mold. The insert changeover system includes a mold body having a pneumatic pull stock clamp and an insert having an insert guide pin. The pneumatic pull stock clamp is configured to releasably secure the insert guide pin when the insert is mounted on the mold body to selectively lock and unlock a position of the insert.

A semiconductor die encapsulation or carrier-mounting method and apparatus for manufacturing a semiconductor product, wherein a first tool part for holding multiple semiconductor dies is provided and the semiconductor dies are placed on the first tool part, one of the first and a second tool part including displaceable insert members applying a pressure by each displaceable insert member on a surface area of the semiconductor die, and the first and second tool parts are brought together to define a space between the first and second tool parts with the semiconductor products being arranged within the space. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure, and subsequently, the first and second tool parts are separated and the processed semiconductor dies removed.