A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

A joint and a method of bonding a first member to a second member are disclosed. The joint includes a multi-layer adhesive material between the first member and the second member. The multi-layer adhesive material includes at least one adhesive material that is applied to one of the first member and the second member. The multi-layer adhesive material also includes a heating element for heating the at least one adhesive material and at least one permeable layer for allowing air to escape from between the first member and second member during heating of the at least one adhesive material.

A multi-layer film for an electronic device display having a clear, material base sheet film with a first side used by a user that is scratch resistant; a clear adhesive layer formed on a second side of the material base sheet film; and a synthetic separator film, that has excellent linear directional tear properties, that is temporarily affixed to the adhesive layer so that it can be removed by the user.

A method for joining two carpet segments, each carpet segment having an underside and at least one edge, comprises abutting one edge of one carpet segment with one edge of the other carpet segment, positioning a length of seam tape under the abutting edges, and activating the adhesive to secure the seam tape to the undersides of both carpet segments. The seam tape comprises an elongated base layer being resilient in a longitudinal direction, an intervening layer applied to the base layer, and an adhesive applied to the intervening layer.

A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150 C. in the epoxy resin used for producing the composite component.

An implant for electric resistance welding of elements made of composites, with a frame of thermoplastic materials, reinforced with conductive fibres, in a flat multilayered structure with an upper and lower surface, and includes an electrically resistant layer of a flat sheet with openings, made of a conductive material, additional layers made of the frame material, one of which covers the electrically resistant layer from the top, and the other one from the bottom. The implant includes porous insulating layers made of an electrically nonconductive material, one covers the implant from the top, contacting the upper layer of the frame material, and the other covers the implant from the bottom, contacting the lower layer of the frame material. The layers are merged with each other in a flat, multilayered inset placed between the welded elements, and the electrically resistant layer has electrical connections for connecting a source of electrical current.

A method of bonding materials may comprise defining a bond interface between two materials in a cure zone on a surface of an object, and non-conductively heating the bond interface without directly heating the surface outside of the cure zone. Non-conductively heating the bond interface may involve applying microwave radiation to the bond interface.

A method of assessing bond quality of a bond between first and second composite parts may include bonding an indication film to the first composite part. The indication film may include NDI-detectable particles arranged in a pattern and bound to polymer chains located inside particle regions. The polymer chains and particles may be stationary during bonding of the indication film to the first composite part. The method may additionally include bonding the first and second composite parts along an assembly bondline during which the particles in the indication film migrate with the polymer chains. The method may further include NDI-inspection of the assembly bondline by observing the appearance of the particles along a direction locally normal to an in-plane direction of the assembly bondline, and determining the bond quality of the assembly bondline based on particle density in the in-plane direction.

A structural joint includes a first member having a first base portion and a first leg portion. The structural joint further includes a second member having a second base portion and a second base portion. The first base portion and the second base portion are coupled together at an overlapping portion. The first leg portion and the second leg portion form a cavity for structurally coupling to a structural member.

A resin-rich peel ply that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates. The resin-rich peel ply is composed of a woven fabric impregnated with a resin matrix different from the resin matrix of the composite substrate. The peel ply is designed such that, upon manual removal of the peel ply from the composite substrate's surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate, but no fibrous material from the woven fabric remains on the same surface.