Patent classifications
B29C66/3282
PROCESSING ELEMENT COMPRISING A STRUCTURAL ELEMENT
The present invention relates to a processing element for processing a material, such as, e.g. a sonotrode or an anvil, having a substantially cylindrical or cylinder-segment-shaped carrier surface which is intended to come into contact with the material during processing, the processing element being provided to be rotated about its longitudinal axis during processing, so that the carrier surface moves in a circumferential direction and rolls on the material to be processed, wherein at least one structural element is arranged on the carrier surface, which structural element protrudes in a radial direction beyond the carrier surface, wherein the structural element has a top surface which is intended to come into contact with the material to be processed. In order to provide a processing element enabling reliable welding at a higher feed rate, it is proposed according to the invention that the top surface comprises a base section and at least one recess section having a smaller distance from the longitudinal axis than the base section, wherein in a sectional view perpendicularly to the longitudinal axis, the base section and the recess section are arranged next to one another.
Transparent material processing with an ultrashort pulse laser
Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.
Apparatus and method for sealing pouch case of secondary battery
The present disclosure discloses an apparatus and method for sealing a pouch case that optimizes a sealing shape or structure of a sealing portion at an inner side of the pouch case to ensure insulation of a secondary battery. The apparatus for sealing a pouch case of a pouch-type secondary battery according to the present disclosure includes an upper compression jig to apply pressure to a sealing portion of the pouch case in a downward direction, and a lower compression jig to apply pressure to the sealing portion of the pouch case in an upward direction, and at least one of the upper compression jig and the lower compression jig applies the pressure to the pouch case at different depths at an inner side end and an outer side end.
TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER
A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.
Transparent material processing with an ultrashort pulse laser
A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.