Patent classifications
B29C2945/76709
FOAM MOLDING METHOD AND INJECTION MOLDING MACHINE
To provide a new foam molding method and injection molding machine capable of solving variation in a wall thickness and a foamed state, sensor corrosion, a complexity of sensor positioning, and the like. The above-described problem is solved by a foam molding method comprising a resin filling step of filling a mold (2), clamped by a predetermined mold clamping force (Pc), with a resin (R) at a predetermined molding injection pressure (Pi), a filling stopping step of stopping the filling of the resin (R) when, while monitoring a mold gap (Lm) of the mold (2) during the filling, a predetermined mold gap value set in advance is reached, a surface layer curing and filled resin cooling step of curing a surface layer of the resin (R) for a certain time and cooling the filled resin (R) for a certain time after the filling of the resin (R) is stopped, a volume controlling step of controlling a volume increase by reducing the mold clamping force after curing the surface layer of the resin (R) for a certain time, and a taking out step of taking out a foam-molded product by opening the mold (2) after the volume control is performed and after cooling the filled resin (R) for a certain time.
Molding system, molding apparatus, inspection apparatus, inspection method, and program
The molding system including a molding apparatus comprising, a mold clamping force sensor for detecting a mold clamping force generated in a mold, a detection unit for detecting an apparatus failure of the molding apparatus and/or molding of a defective article by the molding apparatus based on an amount of change in mold clamping force detected by the mold clamping force sensor, an operation mode prediction unit for predicting the operation mode of the molding apparatus based on an amount of change in mold clamping force detected by the mold clamping force sensor and, an actual operation mode acquisition unit for acquiring the actual operation mode of the molding apparatus without relying on the mold clamping force sensor.
Mold clamping device of injection molding machine and method of adjusting mold thickness of mold clamping device
A mold clamping device of an injection molding machine includes a mold clamping shaft fixed to a movable platen, a mold clamping ram to press the mold clamping shaft against a fixed platen, a ram position detecting member that detects a position of the mold clamping ram, an encoder detecting a position of the movable platen, a ram position control member that hydraulically controls a position of the mold clamping ram, a storage unit storing a difference value of mold closing positions of the movable platen before and after mold replacement, and a control unit. The control unit calculates the difference value when mold thickness adjustment is performed, calculates a movement position of the mold clamping ram based on a current position of the mold clamping ram and the difference value, moves the mold clamping ram to the movement position, and stops the mold clamping ram to perform mold clamping.
Mold clamping apparatrus, molding apparatus and molding method
A mold clamping apparatus according to the present invention includes: a fixed platen to which one mold of a pair of molds is to be mounted; a movable platen which is disposed opposite the fixed platen and to which the other mold is to be mounted; a pressure-receiving platen connected to the fixed platen via tie bars; a mold opening/closing mechanism including a toggle link mechanism for opening/closing and clamping the molds by moving the movable platen back and forth; a drive mechanism including a servo motor for driving the mold opening/closing mechanism; and a control device for controlling the servo motor, wherein the control device includes an acceleration/deceleration adjustment section capable of adjusting an acceleration time, a deceleration time and a target speed of the servo motor during a mold clamping operation.
Opening/closing device, molding apparatus, and molding method
An opening/closing device (14) includes: a stationary platen (20); a movable platen (22) capable of moving toward or away from the stationary platen (20); an opening/closing mechanism (28) having a plurality of toggle links (30, 31, 32) at least one (32) of which is connected to the movable platen (22); a driving device (37) including a cross head (26) connected to at least one (30) of the toggle links and capable of moving the movable platen (22); and a control portion (50). The control portion (50) is configured to control the cross head (26) such that the movable platen (22) moves at fixed speed during fine die-opening operation.
Molding die, molding die system, and compression molding method
In a molding die, movable die elements are respectively received in die element receiving holes formed in a frame plate. An end surface of the frame plate, which faces a cavity at a location that is other than locations of the die element receiving holes, forms a frame portion compression surface. An end surface of each movable die element, which faces the cavity, forms a split compression surface. Die element drive devices respectively drive the split compression surfaces of the movable die elements. A whole compression plate commonly supports an opposite end part of the frame plate and opposite end parts of the movable die elements, which are opposite from the cavity. When the whole compression plate is moved forward, the whole compression plate integrally drives the frame plate and the movable die elements forward. A whole drive device drives the whole compression plate.
MOLDING SYSTEM, MOLDING APPARATUS, INSPECTION APPARATUS, INSPECTION METHOD, AND PROGRAM
The molding system including a molding apparatus comprising, a mold clamping force sensor for detecting a mold clamping force generated in a mold, a detection unit for detecting an apparatus failure of the molding apparatus and/or molding of a defective article by the molding apparatus based on an amount of change in mold clamping force detected by the mold clamping force sensor, an operation mode prediction unit for predicting the operation mode of the molding apparatus based on an amount of change in mold clamping force detected by the mold clamping force sensor and, an actual operation mode acquisition unit for acquiring the actual operation mode of the molding apparatus without relying on the mold clamping force sensor.
Resin molding method and resin molding apparatus
A resin molding method according to the present invention is a resin molding method that fills a space between an insertion hole provided in a workpiece and a member to be fixed inserted into the insertion hole with resin, the method comprising: injecting a first tablet formed of thermosetting resin having a first temperature into a position of a pot far from the workpiece, the pot pouring the resin into the workpiece and being provided in a molding die, injecting a second tablet formed of thermosetting resin having a second temperature higher than the first temperature into a position of the pot close to the workpiece; pouring the thermosetting resin into the insertion hole of the workpiece in an order of the second tablet and the first tablet by a plunger that slides in the pot.
INJECTION MOLDING DEVICE
An injection molding device includes a housing having a door, an injection molding machine, a detection section, and a control section. The control section controls voltage applied to the mold clamping motor, and performs mold-clamping and mold-opening of the upper mold and the lower mold by either moving the injection unit and the upper mold along the vertical direction or by moving the lower mold along the vertical direction. The mold clamping device further includes a first brake section that, when application of voltage to the mold clamping motor is stopped, regulates movement of the injection unit and the upper mold in the vertical direction or movement of the lower mold in the vertical direction. When the detection section detects that the door is open or detects intrusion of foreign matter, the control section stops application of voltage to the mold clamping motor.
ARRANGEMENT WITH A FIRST CLAMPING UNIT FOR A MOLDING MACHINE
An arrangement with a first clamping unit including a first fixed platen and a first movable platen movable relative thereto, a first clamping force mechanism to apply a clamping force to the first movable platen, and a control or regulating unit for controlling or regulating the first clamping force mechanism. Arranged next to and/or above the first clamping unit is a second clamping unit including a second fixed platen or the first fixed platen and a second movable platen movable relative thereto and which are suitable for carrying at least one mold, and a second clamping force mechanism to apply a clamping force to the second movable platen. The control or regulating unit can actuate the first clamping force mechanism and the second clamping force mechanism to apply a clamping force synchronously when all platens present jointly carry a mold.