B41J2/145

Monolithic carrier structure for digital dispensing

A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

Monolithic carrier structure for digital dispensing

A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

Liquid Discharge Apparatus
20220184947 · 2022-06-16 ·

The width by which the first, second heads overlap each other cross-sectionally along the first direction is greater than the width by which the fifth, sixth heads overlap each other cross-sectionally along the first direction.

Liquid Discharge Apparatus
20220184947 · 2022-06-16 ·

The width by which the first, second heads overlap each other cross-sectionally along the first direction is greater than the width by which the fifth, sixth heads overlap each other cross-sectionally along the first direction.

Liquid ejecting device
11345153 · 2022-05-31 · ·

A supporting section is disposed to confront an ejection surface and supports a recording medium. A first tank is mounted on a first-tank mount section. A liquid conveying section conveys liquid to a liquid ejecting head. A receiving section receives liquid ejected from the liquid ejecting head. A waste-liquid conveying section conveys liquid to the waste-liquid tank. A first casing holds the liquid ejecting head, the first-tank mount section, and the liquid conveying section. A second casing holds the supporting section, the receiving section, the waste-liquid tank, and the waste-liquid conveying section. The first casing is connected with the second casing such that the first casing is movable relative to the second casing. The first casing takes a first position at which the ejection surface confronts the supporting section and a second position at which the ejection surface is farther away from the supporting section than at the first position.

Multi-layered sheet suitable as floor or wall covering exhibiting a three-dimensional relief and a decorative image

The present invention relates to a multi-layered sheet suitable as floor or wall covering exhibiting a three-dimensional surface relief and a decorative image, comprising: i. a support layer having an upper surface and a lower surface; ii. a foamed layer having an upper surface and a lower surface, the lower surface of the foamed layer provided adjacent, and adherent to the upper surface of the support layer, the upper surface of the foamed layer comprising a discontinuous chemically embossed relief pattern, wherein the discontinuous chemically embossed relief pattern comprises indentations formed by single or stacked dots of a digitally printed material comprising a foam inhibiting agent; and optionally iii. a decorative layer adhered to the upper surface of the foamed layer; and optionally iv. at least one wear resistant layer provided adjacent and adhered to the decorative layer; and optionally v. a backing layer provided adjacent and adhered to the lower surface of the support layer.

Printing apparatus and carriage

A printing apparatus includes a head unit having a support portion configured to support a plurality of heads capable of discharging a droplet in a discharge direction, and a carriage on which the head unit is removably mounted from upstream in the discharge direction, wherein the carriage has a bottom formed with an opening from which a nozzle surface of the head for discharging the droplet is exposed, the support portion is provided with at least one protruding portion protruding from a bottom surface of the support portion in the discharge direction, and the bottom is provided with an insertion hole through which the at least one protruding portion is inserted, and a biasing member biasing the support portion in an intersecting direction intersecting with the discharge direction in a state where the at least one protruding portion is inserted through the insertion hole.

Printing apparatus and carriage

A printing apparatus includes a head unit having a support portion configured to support a plurality of heads capable of discharging a droplet in a discharge direction, and a carriage on which the head unit is removably mounted from upstream in the discharge direction, wherein the carriage has a bottom formed with an opening from which a nozzle surface of the head for discharging the droplet is exposed, the support portion is provided with at least one protruding portion protruding from a bottom surface of the support portion in the discharge direction, and the bottom is provided with an insertion hole through which the at least one protruding portion is inserted, and a biasing member biasing the support portion in an intersecting direction intersecting with the discharge direction in a state where the at least one protruding portion is inserted through the insertion hole.

WAFER STRUCTURE

A wafer structure including a chip substrate and plural inkjet chips is disclosed. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the first inkjet chip and the second inkjet chip. Each of the first inkjet chip and the second inkjet chip includes plural ink-drop generators. Each of the ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and form plural horizontal axis array groups having a central stepped pitch equal to 1/600 inches or less.

WAFER STRUCTURE

A wafer structure including a chip substrate and plural inkjet chips is disclosed. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the first inkjet chip and the second inkjet chip. Each of the first inkjet chip and the second inkjet chip includes plural ink-drop generators. Each of the ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and form plural horizontal axis array groups having a central stepped pitch equal to 1/600 inches or less.