Patent classifications
B41J2/145
WAFER STRUCTURE
A wafer structure is disclosed and includes a chip substrate and an inkjet chip. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the inkjet chip. The inkjet chip includes plural ink-drop generators generated by the semiconductor process on the chip substrate. Each of the plurality of ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and plural horizontal axis array groups having a central stepped pitch equal to or less than 1/600 inches.
Wafer structure
A wafer structure including a chip substrate and plural inkjet chips is disclosed. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips are formed on the chip substrate by the semiconductor process and diced into the first inkjet chip and the second inkjet chip. Each of the first inkjet chip and the second inkjet chip includes plural ink-drop generators. Each of the ink-drop generators includes a nozzle. A diameter of the nozzle is in a range between 0.5 micrometers and 10 micrometers. A volume of an inkjet drop discharged from the nozzle is in a range between 1 femtoliter and 3 picoliters. The ink-drop generators form plural longitudinal axis array groups having a pitch and form plural horizontal axis array groups having a central stepped pitch equal to 1/600 inches or less.
LIQUID DISCHARGE HEAD
There is provided a liquid discharge head including: a plurality of nozzles arranged in a first direction; a plurality of pressure chambers; a plurality of throttles; and a common channel extending in the first direction and connected to the plurality of throttles. The common channel has: a supply port, and a terminal part which is at least one of both end parts in the first direction of the common channel, the supply port being not provided at the terminal part. A terminal throttle which is one of the plurality of throttles and which is positioned closest to the terminal part among the plurality of throttles has a channel resistance same as a channel resistance of a throttle of the plurality of throttles different from the terminal throttle, and extends from a connection between the terminal throttle and one of the plurality of pressure chambers to the terminal part.
LIQUID DISCHARGE HEAD
There is provided a liquid discharge head including: a plurality of nozzles arranged in a first direction; a plurality of pressure chambers; a plurality of throttles; and a common channel extending in the first direction and connected to the plurality of throttles. The common channel has: a supply port, and a terminal part which is at least one of both end parts in the first direction of the common channel, the supply port being not provided at the terminal part. A terminal throttle which is one of the plurality of throttles and which is positioned closest to the terminal part among the plurality of throttles has a channel resistance same as a channel resistance of a throttle of the plurality of throttles different from the terminal throttle, and extends from a connection between the terminal throttle and one of the plurality of pressure chambers to the terminal part.
INKJET PRINTING APPARATUS
An inkjet printing apparatus according to an embodiment includes a stage where a target substrate is disposed, and an inkjet head that discharges ink on the target substrate. The inkjet head includes a tank that stores the ink, nozzles that are provided on the tank and discharge the ink, and a damper that is disposed in the tank, and the damper comprises a protruding portion that protrudes toward the nozzles from the damper.
INKJET PRINTING APPARATUS
An inkjet printing apparatus according to an embodiment includes a stage where a target substrate is disposed, and an inkjet head that discharges ink on the target substrate. The inkjet head includes a tank that stores the ink, nozzles that are provided on the tank and discharge the ink, and a damper that is disposed in the tank, and the damper comprises a protruding portion that protrudes toward the nozzles from the damper.
Liquid discharging apparatus and support body
The plurality of first nozzles and the plurality of second nozzles are arranged such that a distance between nozzles adjacent to each other in a first direction is a first distance, the support body is provided with a first fixing portion for fixing the first head unit onto the support body and a second fixing portion for fixing the second head unit onto the support body, and a distance between the first fixing portion and the second fixing portion in the first direction is a second distance that is different from an integral multiple of the first distance.
Liquid discharging apparatus and support body
The plurality of first nozzles and the plurality of second nozzles are arranged such that a distance between nozzles adjacent to each other in a first direction is a first distance, the support body is provided with a first fixing portion for fixing the first head unit onto the support body and a second fixing portion for fixing the second head unit onto the support body, and a distance between the first fixing portion and the second fixing portion in the first direction is a second distance that is different from an integral multiple of the first distance.
Wafer structure
A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process. At least one inkjet chip is directly formed on the chip substrate by the semiconductor process and diced into the at least one inkjet chip for inkjet printing. Each of the inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.
Drop size monitoring mechanism
A system is disclosed. The system includes at least one physical memory device to store drop size logic and one or more processors coupled with the at least one physical memory device to execute the drop size logic to receive first ink drop size data for each of a plurality of color planes associated with a first halftone design, generate first ink drop count data for each of the plurality of color planes based on the first halftone design and print job data, generate second ink drop count data for each of the plurality of color planes based on a second halftone design and the print job data and generate second ink drop size data for each of the plurality of color planes associated with the second halftone design based on the first ink drop count data, the first ink drop size data and the second ink drop count data.