Patent classifications
B
B60
B60G
17/00
B60G17/015
B60G17/019
B60G17/01908
B60G17/01925
B60G17/01925
BALL JOINT STUD SENSING ASSEMBLY AND METHOD
20250153531
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2025-05-15
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Provided is a ball joint stud sensing assembly and method. A sensor package disposed in ball joint assembly includes a magnet at a first ball joint assembly component of the ball joint assembly, the magnet having a magnetic field, and a sensor at a second ball joint assembly component of the ball joint assembly, the sensor measuring fluctuations in the magnetic field, wherein the fluctuations indicate an oscillation and displacement of the first ball joint assembly component relative to the second ball joint assembly component.