B60G17/01925

BALL JOINT STUD SENSING ASSEMBLY AND METHOD

Provided is a ball joint stud sensing assembly and method. A sensor package disposed in ball joint assembly includes a magnet at a first ball joint assembly component of the ball joint assembly, the magnet having a magnetic field, and a sensor at a second ball joint assembly component of the ball joint assembly, the sensor measuring fluctuations in the magnetic field, wherein the fluctuations indicate an oscillation and displacement of the first ball joint assembly component relative to the second ball joint assembly component.