An apparatus includes a thermally conductive interface assembly including a first component associated with a first interface surface and a second component associated with a second interface surface. The apparatus also includes a shape memory alloy component coupled to the thermally conductive interface assembly and configured to move one or more components of the thermally conductive interface assembly between a first state and a second state based on a temperature of the shape memory alloy component. In the first state, the first interface surface is in physical contact with the second interface surface, and in the second state, a gap is defined between the first interface surface and the second interface surface.

A heat transfer device is disclosed having a housing including a first main wall and a second main wall, the housing having a sealed internal cavity, a liquid contained in the internal cavity, and a mixer able to set the liquid in motion, the heat transfer device being able to be switched between a first state and a second state in which the liquid is in motion and transfers heat by convection between the first main wall and the second main wall, the thermal conductance between the first main wall and the second main wall in the first state being four times less than the thermal conductance between the first main wall and the second main wall in the second state.

A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.

A modular satellite having a plurality of electronics boxes that accommodate electrical and/or electronic modules. The electronics boxes are or can be electrically connected with one another. The satellite is provided with a basis structural panel, a docking structure disposed on the basis structural panel, and a plurality of device carrier panels that are or can be connected with the docking structure. The docking structure has first electrical connection elements for an electrical connection with the electronics boxes. The device carrier panels have mechanical connection elements for holding the electronics boxes. The respective device carrier panel is configured, at least in certain regions, so that it can be tempered by means of integrated heat sources and/or heat sinks.

Systems, methods, and apparatus for dual condenser loop heat pipes for satellites with sun-normal radiators are disclosed. In one or more embodiments, a disclosed method for a satellite thermal management system comprises heating, in an evaporator, a liquid to convert the liquid to a vapor. The method further comprises passively circulating within tubing, from the evaporator, the vapor to a first radiator not illuminated by a sun and to a second radiator illuminated by the sun. Also, the method comprises converting the vapor to the liquid when the vapor is within the first radiator not illuminated by the sun. Further, the method comprises passively circulating within the tubing, from the first radiator not illuminated by the sun, the liquid to the evaporator.

Deployable radiator devices, systems, and methods utilizing composite laminates are provide in accordance with various embodiments. For example, some embodiments include a deployable radiator system. The system may include one or more radiators and one or more thermally-conductive, bendable hinges. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be coupled with a respective radiator from the one or more radiators. Each respective thermally-conductive, bendable hinge from the one or more thermally-conductive, bendable hinges may be configured to conduct heat to the respective radiator from the one or more radiators. Some embodiments include one or more heat pipes, which may be flat. Some embodiments include heat pipes with vapor channels and liquid channels configured in a same plane of the heat pipe. Methods of utilizing the systems and/or devices may be also provided.

Disclosed is a heat exchange device for effecting a heat exchange between a heat transfer fluid of a first network of capillary heat pipes and a heat transfer fluid of a second network of capillary heat pipes. The heat exchange device includes a solid block provided with a first channel and a second channel which are independent of one another, the first channel having at least one opening intended to be connected to a capillary heat pipe of the first network, the second channel having at least one opening intended to be connected to a capillary heat pipe of the second network, the first channel having a portion which lies near a portion of the second channel such that the heat transfer fluid of the first network is able to exchange heat with the heat transfer fluid of the second network via the heat exchanging portions.

An energy-saving loop heat pipe apparatus and an application. The loop heat pipe apparatus comprises a capillary pump component and an evaporation unit component. The loop heat pipe apparatus further comprises at least one heat exchanger disposed between the capillary pump component and the evaporation unit component for heating, by using heat of a circulating working medium in the loop heat pipe, the circulating working medium about to enter the evaporation unit component. By providing heat exchangers between the evaporation unit component and the capillary pump component, the energy-saving loop heat pipe apparatus may use heat of a gas-phase working medium flowing out of the evaporation unit component to heat a liquid-phase working medium about to enter the evaporation unit component, so that waste heat is utilized to the fullest extent and energy is saved.

An orifice insert is provided and includes a center plug and a ring feature. The center plug has first and second ends and an exterior surface extending between the first and second ends. The exterior surface defines multiple inflow channels that extend from the first end toward the second end and terminate at termination points midway between the first and second ends. The ring feature is disposed about the center plug and the multiple inflow channels to define, with the center plug, a plenum with which the termination points of the multiple inflow channels are fluidly communicative.

A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.