A Bernoulli gripper for ophthalmic lenses includes a gripper body with a first cavity corresponding in shape to an optic zone of an ophthalmic lens and a first channel formed within the gripper body. The first channel penetrates the first cavity at one end and includes a first port in the gripper body at another end of the first channel. The first channel is enabled to supply a fluid medium from the first port to the first cavity at a first velocity such that the ophthalmic lens positioned with the optic zone in proximity to the first cavity is subject to a first pressure force against the first cavity by the Bernoulli effect.

To provide: a guide roller, whereby a replacement operation time can be shortened, guide roller position adjustment operations are not needed, and an equipment stop time can be reduced, and which contributes to suppression of productivity deterioration; and a substrate transfer apparatus provided with the guide roller. A substrate transfer apparatus (1) is provided with transfer rollers (3); a plurality of transfer shafts (2) that are provided with the transfer rollers (3); a guide roller (5) that guides a substrate (10); and a roller holding section (6) having a supporting shaft (62) that supports the guide roller (5) at one end. A contact section (52) of the guide roller (5) in contact with the substrate (10) can be separated from other sections (a base section (51) and a nut section (53)).

System and methods for manipulating and sorting of objects being moved along a conveyor are disclosed, whereby control of the object is achieved through the application of one or more of vacuum, impaling, or mechanical grasping. One embodiment is directed to a robotic arm and vision detection system operable for detecting a target object to be grasped from a stream of objects being moved on a conveyor, and moving a suction head into position over the target object that has been detected on the conveyor, the suction head having a flexible cup section disposed at a distal end thereof, the vacuum item pick-up system/method using high subsonic air flow (e.g., on the order of 60 scfm or more) through a suction cup having a flow opening area large enough that an airflow of 60 scfm does not result in an airspeed exceeding Mach 0.2 under standard conditions of temperature and pressure, and further having a flow opening area whose ratio to cup opening area falls between 0.36 and 1.44 for applying a desired vacuum suction force for grasping the target object. Either as a primary grasping mechanism, or as an optional supplemental grasping mechanism, a piercing mechanism may be inserted into the object and used to manipulate the object in space. Alternate systems/methods for manipulating and sorting objects via hitting, flicking, or pushing are also disclosed.

System and methods for manipulating and sorting of objects being moved along a conveyor are disclosed, whereby control of the object is achieved through the application of one or more of vacuum, impaling, or mechanical grasping. One embodiment is directed to a robotic arm and vision detection system operable for detecting a target object to be grasped from a stream of objects being moved on a conveyor, and moving a suction head into position over the target object that has been detected on the conveyor, the suction head having a flexible cup section disposed at a distal end thereof, the vacuum item pick-up system/method using high subsonic air flow (e.g., on the order of 60 scfm or more) through a suction cup having a flow opening area large enough that an airflow of 60 scfm does not result in an airspeed exceeding Mach 0.2 under standard conditions of temperature and pressure, and further having a flow opening area whose ratio to cup opening area falls between 0.36 and 1.44 for applying a desired vacuum suction force for grasping the target object. Either as a primary grasping mechanism, or as an optional supplemental grasping mechanism, a piercing mechanism may be inserted into the object and used to manipulate the object in space. Alternate systems/methods for manipulating and sorting objects via hitting, flicking, or pushing are also disclosed.

System and methods for manipulating and sorting of objects being moved along a conveyor are disclosed, whereby control of the object is achieved through the application of one or more of vacuum, impaling, or mechanical grasping. One embodiment is directed to a robotic arm and vision detection system operable for detecting a target object to be grasped from a stream of objects being moved on a conveyor, and moving a suction head into position over the target object that has been detected on the conveyor, the suction head having a flexible cup section disposed at a distal end thereof, the vacuum item pick-up system/method using high subsonic air flow (e.g., on the order of 60 scfm or more) through a suction cup having a flow opening area large enough that an airflow of 60 scfm does not result in an airspeed exceeding Mach 0.2 under standard conditions of temperature and pressure, and further having a flow opening area whose ratio to cup opening area falls between 0.36 and 1.44 for applying a desired vacuum suction force for grasping the target object. Either as a primary grasping mechanism, or as an optional supplemental grasping mechanism, a piercing mechanism may be inserted into the object and used to manipulate the object in space. Alternate systems/methods for manipulating and sorting objects via hitting, flicking, or pushing are also disclosed.

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

A method is provided for transporting components using a gripping apparatus. The gripping apparatus includes a body defining a chamber and includes an exhaust at a first end of the body. The gripping apparatus also includes an air conveyor positioned within the chamber. The method includes attaching a gripper head to a second end of the body opposite to the first end. The gripper head defines one or more openings and a nest. The method further includes generating an air flow through an inlet of the air conveyor and out through the exhaust. The method further includes applying suction via the one or more openings in the gripper head to locate and releasably hold one of the components with the gripper head at the first location based on the generating step. The method further includes transporting the component from the first location to a second location.

A processing apparatus includes a wafer unloading unit, a wafer table, a frame unloading unit, a frame table, a tape affixing unit, a tape-affixed frame transporting unit, a tape compression-bonding unit, a frame unit unloading unit that unloads a frame unit in which a tape of a tape-affixed frame and the undersurface of a wafer are compression-bonded to each other from the wafer table, a reinforcing portion removing unit, a no-ring unit unloading unit, and a frame cassette table.

A suction device includes a valve, a piezoelectric pump, and a housing. The valve includes a valve casing and a diaphragm. A first ventilation hole, a second ventilation hole, and a third ventilation hole are formed in the valve casing. The diaphragm is fixed to the valve casing and forms a flow path in the valve casing. The second ventilation hole is opened under atmospheric pressure. The piezoelectric pump has a suction hole and a discharge hole. The discharge hole is in communication with the first ventilation hole. The housing has a cavity. A suction pad is attached to the cavity. The housing forms an enclosed space together with the valve and the piezoelectric pump. The enclosed space is a space that is in communication with the cavity, the suction hole, and the third ventilation hole.

A substrate processing apparatus may include a substrate jig device and a transfer unit, which is configured to hold a substrate in a non-contact state and move the substrate toward the substrate jig device. The substrate jig device may include a supporter, which is configured to support an edge of the substrate and have an opening, a first suction part, which overlaps with a center region of the opening and is configured to move in a first direction, and a plurality of second suction parts, which overlap with an edge region of the opening and are configured to move toward the opening. Here, the first direction may be a direction passing through the opening.