Robust and reliable microelectromechanical photoswitch devices are provided. The devices are better able to withstand mechanical shock and rough handling during transportation or field operation due to the use of a mechanical stop structure that limits displacement of movable parts of the devices and prevents their contacts from becoming locked. The technology also greatly extends the dynamic range of the sensors, enabling them to detect weak electromagnetic radiation signals as well as much stronger signals without damage when exposed to signals that are orders of magnitude larger than threshold.

An actuator of a micro-electromechanical system (MEMS) includes a semiconductor substrate. The actuator includes an array of micromechanical arms disposed over the semiconductor substrate. The actuator includes a first capping member disposed over the micromechanical arms. The actuator includes a second capping member disposed opposite the first capping member such that the micromechanical arms extend between the first capping member and the second capping member along a vertical direction.

A method for producing microelectromechanical structures. The method includes: providing a carrier substrate having a central layer, and an insulation layer which is disposed on one side of the central layer and is applied to the surface; applying a silicon layer to the insulation layer; structuring the silicon layer forming trenches through the silicon layer in places; passivating the silicon layer, wherein the trenches are filled and a passivation layer forms; structuring the passivation layer, sacrificial regions and functional regions being formed, the sacrificial regions being free of the passivation layer in places; removing part of the carrier substrate forming a new surface; forming a second insulation layer on the new surface; repeating the applying, structuring and passivating for a second silicon layer on the second insulation layer and structuring for a second passivation layer to form sacrificial regions and functional regions and removing all of the sacrificial regions.

A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity disposed in the supporting substrate, a stopper, and a MEMS structure. The stopper is disposed between the supporting substrate and the cavity, and an inner sidewall of the stopper is in contact with the cavity. The stopper includes a filling material surrounding a periphery of the cavity, and a liner wrapping around the filling material. The MEMS structure is disposed over the cavity and attached on the stopper and the supporting substrate.

A method of fabricating a micro-electro-mechanical system (MEMS) device, the steps include: providing a supporting substrate; etching the supporting substrate to form a trench, where the trench surrounds a portion of the supporting substrate; forming a liner in the trench; filling up the trench with a filling material to form a stopper, wherein the stopper comprises the liner and the filling material; forming a MEMS structure on the stopper and the supporting substrate, wherein the MEMS structure includes a through hole; and etching a portion of the supporting substrate to form a cavity by providing an etchant through the through hole, wherein the stopper is in contact with the cavity.