The present invention generally relates to an ovenized platform and a fabrication process thereof. Specifically, the invention relates to an ovenized hybrid Si/SiO.sub.2 platform compatible with typical CMOS and MEMS fabrication processes and methods of its manufacture. Embodiments of the invention may include support arms, CMOS circuitry, temperature sensors, IMUs, and/or heaters among other elements.

Methods of reversing the tone of a pattern having non-uniformly sized features. The methods include depositing a highly conformal hard mask layer over the patterned layer with a non-planar protective coating and etch schemes for minimizing critical dimension variations.

Method for encapsulation of a microelectronic component, including making of a portion of sacrificial material on a front face of a first substrate in which the component is intended to be made, then making of a cover encapsulating the portion of sacrificial material, then making of the component by etching the first substrate from its back face, such that part of the component is arranged to face the portion of sacrificial material and such that the portion of sacrificial material is accessible from a back face of the component, then elimination of the portion of sacrificial material by etching from the back face of the component, then securing of the back face of the component to a second substrate.

Disclosed herein is an alkaline composition for cleaning a substrate including a structure of copper or copper alloy and a structure including cobalt or cobalt alloy, the composition including: (a) 0.0001 to 0.2% by weight of a cobalt corrosion inhibitor selected from a surfactant

##STR00001## (b) 0.0001 to 0.5% by weight of a copper corrosion inhibitor selected from benzotriazole, 5-chloro benzotriazole, 4-methyl benzotriazole; 5-methyl benzotriazole; tetrahydro benzotriazole; and methyl-benzotriazole-1-yl)-methyl-imino-bis-ethanol; (c) 0.05 to 1% by weight of a C.sub.2 to C.sub.7 monoamino alkanol; and (d) a solvent;
where the solvent consists essentially of water.

The present disclosure relates to a method of manufacturing a layered structure for a MEMS apparatus, a layered structure manufactured by the method, and a MEMS apparatus 200 (300, 400, 500) comprising the layered structure. For the layered structure, a high-temperature curing step is provided in the manufacturing process, for example, after structuring the functional layer 3. The structured regions and trenches of the functional layer 3 and in particular the spring structure formed in the functional layer 3 have smoothened side walls and/or rounded corners in regions 3a after the curing step, so that their fracture limits can thus be increased and early fractures of the functional layer 3 during operation of the MEMS apparatus 200 (300, 400, 500) can be avoided.