Patent classifications
B05C5/022
PRINT HEAD FOR THE APPLICATION OF A COATING AGENT ON A COMPONENT
The disclosure concerns a printhead for applying a coating agent to a component, in particular for applying a paint to a motor vehicle body component, having at least one outlet opening for dispensing the coating agent, a coating agent supply for supplying the coating agent to the outlet opening, a movable valve element, the valve element in the closed position closes the outlet opening, whereas the valve element in the open position opens the outlet opening, and with a valve actuator for moving the valve element between the opening position and the closed position. The disclosure additionally provides for a flexible membrane which separates the valve actuator from the coating agent supply, the actuator side of the membrane facing the valve actuator and the coating agent side of the membrane being exposed to the coating agent in the coating agent supply.
SYSTEMS AND METHODS FOR APPLYING MATERIALS TO MEDICAL DEVICES
A method for applying a predetermined pattern of material onto an elongate tubular substrate includes securing a first portion of an elongate tube having a non-circular outer perimeter to an engagement member configured to be rotated by a first motor, such that the elongate tube can be rotated in unison with the engagement member, operating the first motor to rotate the elongate tube, operating a second motor of to change the relative displacement between the elongate tube and a dispensing conduit along a longitudinal axis of the elongate tube, and expelling a conductive adhesive from a fluid dispenser through the dispensing conduit to form a predetermined pattern of the conductive adhesive on a surface of the elongate tube, the predetermined pattern of the conductive adhesive covering at least 180 degrees of the surface along the non-circular outer perimeter over a width of at least two millimeters along the longitudinal axis.
Substrate processing apparatus, estimation method of substrate processing and recording medium
A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.
MANUFACTURING DEVICE OF ORGANIC SEMICONDUCTOR FILM
A device for manufacturing an organic semiconductor film, including a coating member disposed to face a substrate surface while spaced therefrom for forming the film, and forming a liquid reservoir of an organic semiconductor solution between the coating member and the substrate; a supply portion that supplies the solution; and a cover portion that covers at least a crystal growth portion of the solution. The cover portion includes a guide that guides a deposit formed of an evaporated solvent of the solution to a film-unformed region of the organic semiconductor film. While the solution is supplied between the coating member and the substrate surface by the supply portion, the coating member is moved in a first direction parallel to the substrate surface in a state of being in contact with the solution, to form the film with the crystal growth portion as a starting point.
AUTOMATIC PIEZO STROKE ADJUSTMENT
A method of calibrating the jetting profile includes applying voltage to a piezoelectric actuator to move a valve closure structure between non-impact and impact positions, sensing the position of the valve closure structure, establishing a reference point using voltage and position data, and using the reference point to adjust the voltage applied. Another method uses a mechanical stop to calibrate a jetting system. This method includes applying voltage to the piezoelectric actuator to move the valve closure structure between non-impact and impact calibration positions, sensing the position of the valve closure structure, generating voltage and position calibration data, establishing a master reference point using this data, and using the master reference point to determine wear of at least one of: the piezoelectric actuator and the valve closure structure. Another method of operating a jetting system includes the user inputting information into a control component. Another method involves using voltage data and the position data relating to a piezoelectric actuator for preventative maintenance of one or more components of the jetting valve.
Glue delivery system
A glue delivery system and method for providing precise application of glue on a substrate. A bead of glue is extruded from a first glue chamber to a leading edge of the substrate. A trailing edge of the substrate is blown off and over to the nozzle to receive a smear of glue from a second glue chamber. A gear pump is controlled by a servo drive that is connected to a servomotor utilizing a gear reducer. The pump regulates the extrusion of the glue onto the substrate that is programmed with empirical data of gear reducer ratio at which the glue flows within a constant speed, torque, current, speed and position of the glue. The empirical data is provided to a programmable logic circuit to achieve a precise pressure related to volume of a glue deposition and speed of the substrate onto which the glue is applied.
SUBSTRATE PROCESSING APPARATUS, ESTIMATION METHOD OF SUBSTRATE PROCESSING AND RECORDING MEDIUM
A substrate processing apparatus includes a periphery removal unit configured to remove a peripheral portion of a film formed on a surface of a substrate; a profile acquisition unit configured to acquire a removal width profile indicating a relationship between a position in a circumferential direction of the substrate and a width of a portion of the substrate from which the film is removed; and a factor estimation unit configured to output factor information indicating a factor of an error in the width based on the removal width profile.
Edge blackening for optical devices
An optical device coating assembly is provided. The optical device coating assembly includes a substrate support operable to retain an optical device substrate. The coating assembly further includes a first actuator connected to the substrate support. The first actuator is configured to rotate the substrate support. The coating assembly includes a holder configured to hold a coating applicator against an edge of the optical device substrate when the optical device substrate is rotated on the substrate support and a second actuator operable to apply a force on the holder in a direction towards the substrate support. The second actuator is a constant force actuator.
Systems, Devices, and Methods for Providing Customized Oral Care Agents
The various embodiments described herein include methods, devices, and systems for customizing dental care. In one aspect, an oral care agent dispenser device includes: (1) multiple chambers each configured to receive a cartridge containing a different oral care agent ingredient of a plurality of oral care agent ingredients; (2) memory configured to store an oral care agent formulation that includes one or more of the plurality of oral care agent ingredients; and (3) a dispenser positioned above an oral care agent dispensing region, the dispenser configured to dispense one or more of the plurality of oral care agent ingredients in accordance with the oral care agent formulation.
SLOT DIE COATING APPARATUS
The present invention relates to a slot die coating apparatus. A slot die coating apparatus according to an embodiment of the present invention includes: a slot die configured to perform a coating process by applying ink to a substrate; an image capturing unit disposed adjacent to the slot die and configured to capture a state of the slot die and a state of ink applied to the substrate during the coating process; and a control unit configured to compare an image captured by the image capturing unit with a reference image and control an operation of the slot die and a transfer of the substrate.