B06B1/064

Ultrasonic device, method for manufacturing the same, electronic device and ultrasonic imaging device
09818929 · 2017-11-14 · ·

An ultrasonic device includes a substrate having a first opening, a second opening and a wall part partitioning the first opening and the second opening; a first vibration film and a second vibration film which close the first opening and the second opening respectively; a first piezoelectric element and a second piezoelectric element which are formed on surfaces of the first vibration film and the second vibration film opposite to the substrate; an acoustic matching layer which is disposed within the first opening and the second opening so as to come into contact with the first vibration film and the second vibration film.

Sonic device

A sonic device in an embodiment includes a sonic transducer unit and a sonic propagation unit. The sonic transducer unit performs at least one of transmitting and receiving a sonic wave, and has a sonic function surface to configure at least one of a wave transmitting surface and a wave receiving surface. The sonic propagation unit includes: a substrate having a pair of electrodes; an electroadhesive element expressing body including a resin crosslinked body arranged on the substrate, and particles dispersed in the resin crosslinked body; and a power supply to apply voltage to the pair of electrodes. The sonic propagation unit is provided on the sonic function surface of the sonic transducer unit, and the electroadhesive element expressing body in the sonic propagation unit comes into contact with a test object.

Touch feedback and sensing device

A touch feedback and sensing device includes a circuit board, a piezoelectric ceramic actuator on the circuit board; and at least one strain sensor on the circuit board. The piezoelectric ceramic actuator includes a piezoelectric ceramic block, a cathode and an anode on the piezoelectric ceramic block. Different voltages are applied to the cathode and the anode to vibrate the piezoelectric ceramic block. The circuit board vibrates with vibration of the piezoelectric ceramic block. The at least one strain sensor is configured to detect and monitor vibration of the circuit board.

ULTRASONIC IMAGING AND ENERGY DELIVERY DEVICE AND METHOD
20230249220 · 2023-08-10 · ·

An ultrasonic device includes a driving circuit to provide drive power, a first transducer array to generate ultrasonic waves, the first transducer array being connected to receive power from the driving circuit, and a second transducer array to detect reflected or elicited ultrasonic waves incident on the device from a target and generate a signal based on those waves, the second transducer array being acoustically transmissive and disposed over the first transducer array such that the generated ultrasonic waves pass through the second transducer array. The second array is tuned to operate on top of the first. The functions of the two arrays may be reversed and the array tuned to operate with the first array receiving and the second array transmitting.

LINEAR ARRAY ULTRASONIC PROBE
20230305146 · 2023-09-28 ·

Disclosed is a linear array ultrasonic probe, of which a first conductive layer is arranged on an outer wall of a backing body facing an array element layer by means of a gold spraying, electroplating, or chemical plating process, and/or a second conductive layer is arranged on a negative end by means of a gold spraying, electroplating, or chemical plating process, so that a thickness of at least one of the first conductive layer and the second conductive layer can be made thinner, for example, the thickness a≤5 micrometers.

Robust ultrasound transducer probes having protected integrated circuit interconnects

An ultrasound probe is formed with protected interconnects, thereby resulting in a more robust probe. The interconnects are mounted between an array of transducer elements and an integrated circuit. The array of transducer elements are coupled to the interconnect via flip chip bumps or other structures. Underfill material fixedly positions the interconnects to the integrated circuit. A method of making the transducer assembly is provided.

Ultrasound transducer and method of forming ihe same

Embodiments provide an ultrasound transducer. The ultrasound transducer may include a multi-layered membrane having a plurality of slits extending through the membrane, thereby forming a plurality of sections of the membrane at least partially separated by the slits. Each slit extends from a perimeter of the membrane to a respective end position at a predetermined distance away from a center of the membrane. The plurality of sections of the membrane are connected to each other at the center of the membrane.

ULTRASONIC TRANSDUCER ELEMENT, ULTRASONIC PROBE, AND ELECTRODE STRUCTURE OF ULTRASONIC TRANSDUCER ELEMENT

An ultrasonic transducer element according to an embodiment includes a plurality of layers including a piezoelectric element layer. At least one surface of electrodes that forms a pair of adjacent layers among the plurality of layers is made of metal including a plurality of needle-like structures, the pair of adjacent layers being made of conductive material and facing each other.

Planar phased ultrasound transducer array

Planar phased ultrasound transducer including a first layer including a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an epoxy material placed between the piezo frame and the sheet of piezoelectric material. The transducer includes a flex frame secured to a back side of the first layer.

DIFFERENTIAL RECEIVE AT AN ULTRASONIC TRANSDUCER

An ultrasonic transducer device including a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies. The membrane includes a structural layer, a piezoelectric layer having a first surface and a second surface, a first electrode placed on the first surface of the piezoelectric layer, wherein the first electrode is located at the center of the membrane, a second electrode placed on the first surface of the piezoelectric layer, wherein the second electrode is a patterned electrode comprising more than one electrode components that are electrically coupled, and a third electrode coupled to the second surface of the piezoelectric layer and electrically coupled to ground.