B06B1/067

ULTRASOUND TRANSDUCER PROBE WITH MULTI-ROW ARRAY ACOUSTIC STACKS AND ULTRASOUND IMAGING SYSTEM
20240008840 · 2024-01-11 ·

An ultrasound transducer probe with multi-row array acoustic stacks comprises an central acoustic stack and two side acoustic stacks, the central acoustic stack has an inverted trapezoidal shape backing, and the two side acoustic stacks are mounted on each of the two elevation direction sides of the central acoustic stack with an outward tilted angle , this angle ranges from 0 to 30 degrees. When all the acoustic stacks are electronically powered in the same time, an acoustic field with enlarged elevation section will be created to facilitate needle imaging.

ULTRASONIC TRANSDUCER, DIAGNOSTIC ULTRASONIC PROBE, SURGICAL INSTRUMENT, SHEET-TYPE ULTRASONIC PROBE, AND ELECTRONIC APPARATUS
20200253584 · 2020-08-13 ·

[Object] To provide an ultrasonic transducer, a diagnostic ultrasonic probe, a surgical instrument, a sheet-type ultrasonic probe, and an electronic apparatus by which both of favorable reflection characteristics and suppression of reverberation at low cost can be achieved.

[Solving Means] An ultrasonic transducer for ultrasonic imaging according to the present technology includes a piezoelectric layer, an acoustic attenuation layer, and an acoustic reflection layer. The piezoelectric layer is formed of a piezoelectric material and generates ultrasonic waves. The acoustic attenuation layer is formed of an acoustic attenuation material having an acoustic impedance lower than that of the piezoelectric material. The acoustic reflection layer is arranged on a side of the acoustic attenuation layer and which is formed of an acoustic reflection material having an acoustic impedance higher than that of the acoustic attenuation material, the side being opposite to the piezoelectric layer. The acoustic attenuation layer has a thickness which is integer multiple of of a wavelength of an ultrasonic wave generated in the piezoelectric layer, the wavelength being inside the acoustic attenuation layer.

RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYER, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYER
20200255652 · 2020-08-13 · ·

A resin composition for an acoustic matching layer; an acoustic matching sheet formed from the composition; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition, in which the resin composition for an acoustic matching layer includes a binder including a resin; and metal particles having a monodispersity of 40% to 80%, wherein the monodispersity is calculated by equation (1):


monodispersity (%)=(standard deviation of particle sizes of metal particles/average particle size of metal particles)100.

RESIN COMPOSITION FOR ACOUSTIC MATCHING LAYER, CURED PRODUCT, ACOUSTIC MATCHING SHEET, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASURING APPARATUS, METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE, AND MATERIAL SET FOR ACOUSTIC MATCHING LAYER
20200253582 · 2020-08-13 · ·

A resin composition, for an acoustic matching layer, that contains a binder including a resin and surface-treated metal particles; a cured product formed from the composition; an acoustic matching sheet; an acoustic wave probe; an acoustic wave measuring apparatus; a method for manufacturing an acoustic wave probe; and a material set, for an acoustic matching layer, that is suitable for preparation of the composition.

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUCER (PMUT) ON INTEGRATED CIRCUIT (IC) FOR FINGERPRINT SENSING
20200250393 · 2020-08-06 ·

Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing

Microelectromechanical (MEMS) devices and associated methods are disclosed. Piezoelectric MEMS transducers (PMUTs) suitable for integration with complementary metal oxide semiconductor (CMOS) integrated circuit (IC), as well as PMUT arrays having high fill factor for fingerprint sensing, are described.

Ultrasound transducer assembly
10716542 · 2020-07-21 · ·

Ultrasound transducer assemblies and associated systems and method are disclosed herein. In one embodiment, an ultrasound transducer assembly includes at least one matching layer overlies a transducer layer. A plurality of kerfs extends at least into the matching layer. In some aspects, the kerfs are at least partially filled with a filler material that includes microballoons and/or microspheres.

Methods and systems for manufacturing an ultrasound probe

Systems and methods described herein generally relate to forming a conductive layer of an ultrasound probe. The systems and methods form an ultrasound probe that includes a piezoelectric layer, and first and second matching layers. The first matching layer is interposed between the second matching layer and the piezoelectric layer. The second matching layer formed from a material having a select acoustic impedance from a laser activated molded interconnect device (MID) or a three-dimensional printer. The second matching layer being electrically coupled to the piezoelectric layer.

MULTILAYER STRUCTURE OF ULTRASONIC PROBE, ULTRASONIC PROBE, AND ULTRASONIC APPARATUS
20200206778 · 2020-07-02 ·

Object: To provide a multilayer structure of an ultrasonic probe, the multilayer structure being capable of achieving more appropriate acoustic characteristics in accordance with a site from which an ultrasonic image is acquired, a target whose ultrasonic image is to be observed, an object of observing the ultrasonic image, and the like.

Solution: A multilayer structure 2 of an ultrasonic probe includes: a piezoelectric layer 4 from which an ultrasonic wave is emitted to a subject; and a back layer 5 disposed on the piezoelectric layer 4 and opposite the subject across the piezoelectric layer 4, the back layer 5 having an acoustic impedance that is different from an acoustic impedance of the piezoelectric layer 4 within a range from 20% to +20%. The back layer 5 is made of a material including a piezoelectric material or brass. A backing layer 6 is disposed on the back layer 5 and opposite the piezoelectric layer 4 across the back layer 5.

THERMAL CONDUCTIVE LAYER FOR TRANSDUCER FACE TEMPERATURE REDUCTION
20200196992 · 2020-06-25 ·

A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.