Patent classifications
B06B1/067
APPARATUS WITH ULTRASONIC FINGERPRINT SENSOR AND ONE OR MORE RESONATORS, AND RELATED SYSTEMS AND METHODS
Some disclosed implementations include an ultrasonic sensor stack and an acoustic resonator. The acoustic resonator may be configured to enhance ultrasonic waves transmitted by the ultrasonic sensor stack in an ultrasonic frequency range that is suitable for ultrasonic fingerprint sensors. In some examples, the acoustic resonator may include one or more low-impedance layers residing between a first higher-impedance layer and a second higher-impedance layer. Each of the one or more low-impedance layers may have a lower acoustic impedance than an acoustic impedance of the first higher-impedance layer or an acoustic impedance of the second higher-impedance layer. At least one low-impedance layer may have a thickness corresponding to a multiple of a half wavelength at a peak frequency of the acoustic resonator. The peak frequency may be within a frequency range from 1 MHz. to 20 MHz.
ACOUSTIC MATCHING LAYER MATERIAL, ACOUSTIC MATCHING SHEET, COMPOSITION FOR ACOUSTIC MATCHING LAYER MATERIAL, ACOUSTIC WAVE PROBE, ACOUSTIC WAVE MEASUREMENT APPARATUS, AND MANUFACTURING METHOD OF ACOUSTIC WAVE PROBE
Provided are an acoustic matching layer material containing an epoxy resin (A) component having an epoxy equivalent weight of 140 or less and metal particles (B) having a density of 10 g/cm.sup.3 or more at 20? C., in which a content of particles (C) having a density of less than 4.5 g/cm.sup.3 at 20? C. is less than 5% by mass; an acoustic matching sheet; a composition for an acoustic matching layer material; an acoustic wave probe; an acoustic wave measurement apparatus; and a manufacturing method of an acoustic wave probe.
ULTRASOUND PROBE
Disclosed herein is an ultrasound probe. The ultrasound probe includes a first assembly having a first case, a second assembly coupled with the first assembly, having a second case, and configured to be rotatable between a first position of being unfolded with respect to the first assembly and a second position of being folded on the first assembly, a first acoustic module disposed in the inside of the first case, a second acoustic module disposed in the inside of the second case, and a first space reducing portion disposed in at least one of a portion of the first case toward the second assembly and a portion of the second case toward the first assembly, and configured to reduce a space between the first acoustic module and the second acoustic module when the second assembly is at the first position.
ULTRASONIC PROBE
Disclosed herein is a multi-row ultrasonic probe having improved heat dissipation capability. An ultrasonic probe includes a transducer configured to generate ultrasound and having multiple rows, a kerf dividing the transducer into multiple rows, and a heat dissipation member located inside the kerf and transferring heat generated by the transducer to the outside.
HIGH FREQUENCY ULTRASOUND TRANSDUCER HAVING AN ULTRASONIC LENS WITH INTEGRAL CENTRAL MATCHING LAYER
High frequency ultrasound transducers configured for use with high frequency ultrasound diagnostic imaging systems are disclosed herein. In one embodiment, an ultrasound transducer includes a concave lens having an average thickness in a center portion that that is substantially equal to an odd multiple a ?-wavelength of the center frequency of the ultrasound transducer.
Impedance matching layer for ultrasonic transducers with metallic protection structure
An ultrasonic transducer comprising a piezoelectric element, an acoustic matching layer arranged on a surface of the piezoelectric element and having a thickness of at least one-quarter of a wavelength of a center resonant frequency of the transducer, and a front metal layer arranged on a surface of the acoustic matching layer opposite that of the piezoelectric element and having a thickness equal to one-half of the wavelength of the center resonant frequency.
Ultrasonic device as well as probe and electronic apparatus
An ultrasonic device includes a first element row in which ultrasonic transducer elements are arranged at line-symmetrical positions along a first straight line, where a second straight line orthogonal to the first straight line is the axis of symmetry, and are connected to a first interconnect, and a second element row in which ultrasonic transducer elements are arranged at line-symmetrical positions adjacent to the first element row, where the second straight line is the axis of symmetry, and are connected to a second interconnect. When the distance between a k-th element included in the first element row and a k-th element included in the second element row is represented by D.sub.k, a relationship D.sub.k<D.sub.k+1 is satisfied with respect to at least one value of k.
Focused rotational IVUS transducer using single crystal composite material
An ultrasound transducer for use in intravascular ultrasound (IVUS) imaging systems including a single crystal composite (SCC) layer is provided. The transducer has a front electrode on a side of the SCC layer; and a back electrode on the opposite side of the SCC layer. The SCC layer may have a bowl shape including pillars made of a single crystal piezoelectric material embedded in a polymer matrix. Also provided is an ultrasound transducer as above, with the back electrode split into two electrodes electrically isolated from one another. A method of forming an ultrasound transducer as above is also provided. An IVUS imaging system is provided, including an ultrasound emitter and receiver rotationally disposed within an elongate member; an actuator; and a control system controlling emission of pulses and receiving ultrasound echo data associated with the pulses. The ultrasound emitter and receiver include an ultrasound transducer as above.
Thermal conductive layer for transducer face temperature reduction
A method and apparatus are disclosed herein for a thermally conductive layer for transducer face temperature reduction in an ultrasound transducer assembly. In one embodiment, the ultrasound transducer assembly comprises: a transducer layer configured to emit ultrasound energy; one or more matching layers overlaying the transducer layer; a thermally conductive layer overlaying the one or more matching layers; and a lens overlaying the thermally conductive layer.
ULTRASOUND DEVICE CONTACTING
An ultrasound device (10) is disclosed comprising a transducer arrangement (110) and an acoustically transmissive window (150) over said arrangement, said window comprising an elastomer layer (153) having conductive particles dispersed in the elastomer, the elastomer layer having a pressure-sensitive conductivity, the ultrasound device further comprising an electrode arrangement (160) coupled to said elastomer layer and adapted to measure said pressure-sensitive conductivity. An ultrasound system and arrangement including such an ultrasound device are also disclosed.