Various methods and systems are provided for an ultrasound transducer structure for an ultrasound probe and methods of manufacturing thereof. In one example, the ultrasound transducer structure may include a lens, an acoustic stack disposed on the lens, and an acoustic backing material bonded to a side of the acoustic stack facing away from the lens without any intervening layer between the acoustic backing material and the acoustic stack, such that the acoustic backing material is in face-sharing contact with the side of the acoustic stack, wherein the acoustic backing material is composed of a solidified blend comprising a backing polymer.

Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

Fingerprint identification modules, methods for forming the fingerprint identification modules and electronic devices are provided. The method may include providing a substrate, containing a signal process circuit formed therein; providing a carrier substrate; forming one or more piezoelectric transducers on the carrier substrate, wherein a piezoelectric transducer of the one or more piezoelectric transducers includes a first electrode, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer; forming a permanent bonding layer, containing one or more cavities, on one of the carrier substrate and the substrate; bonding the carrier substrate with the substrate using the permanent bonding layer, wherein the permanent bonding layer is between the one or more piezoelectric transducers and the substrate, and each piezoelectric transducer covers one cavity; and removing the carrier substrate.

An acoustic microelectronic device includes a support, a set of at least one membrane suspended on a face of the support above a cavity by an anchoring zone, and at least one acoustic insulation trench arranged adjacent to the membrane. The device includes at least one bridge connecting the portions of two opposite edges of the trench and located overhanging at least one zone of the trench so as to form, in the zone of the trench, an acoustic insulation box below the bridge.

Various methods and systems are provided for an ultrasound transducer structure for an ultrasound probe and methods of manufacturing thereof. In one example, the ultrasound transducer structure may include a lens, an acoustic stack disposed on the lens, and an acoustic backing material bonded to a side of the acoustic stack facing away from the lens without any intervening layer between the acoustic backing material and the acoustic stack, such that the acoustic backing material is in face-sharing contact with the side of the acoustic stack, wherein the acoustic backing material is composed of a solidified blend comprising a backing polymer.

An ultrasonic probe includes: a piezoelectric element; and a backing material including a matrix resin and thermally conductive particles, arranged on one direction side with respect to the piezoelectric element, wherein a ratio of thermal conductivity of the backing material in a thickness direction to the thermal conductivity of the backing material in a horizontal direction is 3 or more.

Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.

Ultrasound transducer assemblies and methods include a kerf fill material that substantially fills kerfs between adjacent transducer elements. In at least one embodiment, an ultrasound transducer assembly includes a plurality of transducer elements and a plurality of kerfs. Each of the kerfs is disposed between adjacent ones of the transducer elements. A kerf fill material is disposed in the plurality of kerfs. The kerf fill material includes a first material having a first viscosity and a solvent that reduces the first viscosity of the kerf fill material to a second viscosity that is less than the first viscosity. The kerf fill material may include a mixture of a silicone and a volatile methylsiloxane (VMS) fluid.

[Object] To provide an ultrasonic transducer, a diagnostic ultrasonic probe, a surgical instrument, a sheet-type ultrasonic probe, and an electronic apparatus by which both of favorable reflection characteristics and suppression of reverberation at low cost can be achieved.

[Solving Means] An ultrasonic transducer for ultrasonic imaging according to the present technology includes a piezoelectric layer, an acoustic attenuation layer, and an acoustic reflection layer. The piezoelectric layer is formed of a piezoelectric material and generates ultrasonic waves. The acoustic attenuation layer is formed of an acoustic attenuation material having an acoustic impedance lower than that of the piezoelectric material. The acoustic reflection layer is arranged on a side of the acoustic attenuation layer and which is formed of an acoustic reflection material having an acoustic impedance higher than that of the acoustic attenuation material, the side being opposite to the piezoelectric layer. The acoustic attenuation layer has a thickness which is integer multiple of of a wavelength of an ultrasonic wave generated in the piezoelectric layer, the wavelength being inside the acoustic attenuation layer.

Object: To provide a multilayer structure of an ultrasonic probe, the multilayer structure being capable of achieving more appropriate acoustic characteristics in accordance with a site from which an ultrasonic image is acquired, a target whose ultrasonic image is to be observed, an object of observing the ultrasonic image, and the like.

Solution: A multilayer structure 2 of an ultrasonic probe includes: a piezoelectric layer 4 from which an ultrasonic wave is emitted to a subject; and a back layer 5 disposed on the piezoelectric layer 4 and opposite the subject across the piezoelectric layer 4, the back layer 5 having an acoustic impedance that is different from an acoustic impedance of the piezoelectric layer 4 within a range from 20% to +20%. The back layer 5 is made of a material including a piezoelectric material or brass. A backing layer 6 is disposed on the back layer 5 and opposite the piezoelectric layer 4 across the back layer 5.