An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.

An ultrasonic probe has a transduction layer in which a plurality of transducers are placed, a backing layer provided at a rear side of the transduction layer with a wiring layer therebetween, and a plurality of heat dissipation members provided in the backing layer. The plurality of heat dissipation members extend in a line form in the backing layer, and are placed with an aligned direction of extension. An area occupancy percentage of the heat dissipation member at a center region of the backing layer is larger than that at an outer side of the center region. The center region is not positioned at ends of the cross section intersecting the direction of extension of the heat dissipation member, includes a center of gravity of the cross section, and occupies an area less than or equal to a half of an area of the cross section.

A backing includes a heat-conductive particle assemblage with irregular voids and a filler which fills the voids. A portion of ultrasound that propagates backward from a piezoelectric layer scatters and attenuates in the backing. Heat generated at the piezoelectric layer is conducted to a heat exhaust block via the particle assemblage.

This backing material for ultrasonic probes substantially comprises porous amorphous carbon.

A backing 20 includes a lead array 24a that electrically connects each vibration element 12 and a plurality of ICs 32. Each bump 42 provided at a lower end portion of each lead 24 is connected to a conductor pad on an upper side surface of a relay substrate 26, and a ball-shaped terminal 44 of each IC 32 is connected to a lower surface of the relay substrate 26. The lower end portions of the leads 24 are grouped into a plurality of dense groups 46 corresponding to each IC 32 in a longitudinal direction (X-axis direction) by wiring patterns of the leads.

A transducer assembly operable to transmit ultrasonic energy in a desired direction towards a zone adapted to be acoustically coupled to an object or area of interest is provided that has: a transducer layer; a backing layer disposed behind said transducer layer with respect to the desired direction; a back-matching layer disposed between the transducer layer and the backing layer to reflect towards said transducer layer part of the ultrasonic energy directed from the transducer layer to the backing layer; and a heat transfer layer disposed between the back-matching layer and the backing layer to drain heat from the transducer assembly. A process for manufacturing a transducer assembly is also disclosed.

An ultrasonic transducer (200) includes: a piezoelectric vibrator assembly (10), an acoustic matching layer (20), a heat sink (30), and an acoustic absorption layer (40). The heat sink (30) comprises a body (31), and a head portion (32) and a tail portion (33). The body (31) has a central axis extending in a direction from the head portion (32) to the tail portion (33). A surface of the tail portion (33) of the heat sink (30) disposed away from the head portion (32) is a first surface (331). The first surface (331) is an oblique surface or a tapered surface. The angle between the first surface (331) and the central axis is an acute angle. The acoustic absorption layer (40) at least covers the first surface (331).

An ultrasound transducer with at least one piezoelectric element configured to convert received acoustic signals into an electric potential, a shield connectable to ground and overlying the at least one piezoelectric element through which the acoustic signals pass before being received by the at least one piezoelectric element, the shield having acoustic conductivity and electrical attenuation characteristics that enable the acoustic signals to propagate therethrough while reducing a 100 volt per centimeter electric field to below a threshold level so that the piezoelectric element is exposed to a threshold electrical potential at least less than or equal to 10 V, and a housing accommodating the at least one piezoelectric element and shield.

Disclosed is an ultrasound probe including: a piezoelectric body that transmits and receives ultrasound; a backing that is disposed behind the piezoelectric body; and a reflector that is disposed between the piezoelectric body and the backing and that has an acoustic impedance greater than an acoustic impedance of the piezoelectric body; wherein, a thickness of the reflector is within the range of more than 0 to less than 0.05, where is a wavelength of the ultrasound.

A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.