Assemblies for an ultrasonic probe and manufacturing methods are presented. In one example, the method includes additively forming first portions of the assembly using a first material with first acoustic properties and second portions of the assembly using a second material with second acoustic properties, the first and second acoustic properties being configured to modify ultrasonic signals of the ultrasonic probe. In another aspect, a housing for an ultrasonic probe is presented. The housing includes additively-formed portions, a fluid channel, and at least one cavity. The first additively-formed portions include a first material with first acoustic properties. The second additively-formed portions include a second material with second acoustic properties. The first and second acoustic properties are configured to modify ultrasonic signals of the ultrasonic probe. The fluid channel is for receiving fluid within the housing of the ultrasonic probe.

A micromechanical system (MEMS) device package comprising a substrate and a first enclosure including a first cavity, coupled to the substrate. Wherein a transverse dimension of the first cavity relative to the substrate is configured to reduce undesirable acoustic modes within the first cavity and the first cavity comprises an acoustic port. A MEMS device is located inside the first cavity and an Application Specific Integrated Circuit (ASIC) is communicatively coupled to the MEMS device and located outside the first cavity.

[Object] To provide an ultrasonic transducer, a diagnostic ultrasonic probe, a surgical instrument, a sheet-type ultrasonic probe, and an electronic apparatus by which both of favorable reflection characteristics and suppression of reverberation at low cost can be achieved.

[Solving Means] An ultrasonic transducer for ultrasonic imaging according to the present technology includes a piezoelectric layer, an acoustic attenuation layer, and an acoustic reflection layer. The piezoelectric layer is formed of a piezoelectric material and generates ultrasonic waves. The acoustic attenuation layer is formed of an acoustic attenuation material having an acoustic impedance lower than that of the piezoelectric material. The acoustic reflection layer is arranged on a side of the acoustic attenuation layer and which is formed of an acoustic reflection material having an acoustic impedance higher than that of the acoustic attenuation material, the side being opposite to the piezoelectric layer. The acoustic attenuation layer has a thickness which is integer multiple of of a wavelength of an ultrasonic wave generated in the piezoelectric layer, the wavelength being inside the acoustic attenuation layer.

Object: To provide a multilayer structure of an ultrasonic probe, the multilayer structure being capable of achieving more appropriate acoustic characteristics in accordance with a site from which an ultrasonic image is acquired, a target whose ultrasonic image is to be observed, an object of observing the ultrasonic image, and the like.

Solution: A multilayer structure 2 of an ultrasonic probe includes: a piezoelectric layer 4 from which an ultrasonic wave is emitted to a subject; and a back layer 5 disposed on the piezoelectric layer 4 and opposite the subject across the piezoelectric layer 4, the back layer 5 having an acoustic impedance that is different from an acoustic impedance of the piezoelectric layer 4 within a range from 20% to +20%. The back layer 5 is made of a material including a piezoelectric material or brass. A backing layer 6 is disposed on the back layer 5 and opposite the piezoelectric layer 4 across the back layer 5.

A resonance layer (30) and an acoustic separation layer (34) are arranged adjacent to each other between a piezoelectric element (24) and a circuit board (16) provided with an electronic circuit for driving the piezoelectric element. The acoustic impedance of the resonance layer (30) is higher than that of the piezoelectric element (24), and the acoustic impedance of the acoustic separation layer (34) is lower than that of the circuit board (16). An ultrasonic wave is reflected at the interface between the resonance layer (30) and the acoustic separation layer (34) where the difference in acoustic impedance is large, and the ultrasonic wave propagating to the circuit-board (16) side is reduced.

There is provided an ultrasonic transducer having a sample-contacting portion and a back portion, the back portion being opposed to the sample contacting portion. The transducer includes a piezoelectric material configured to be in acoustic communication with a sample and a backing structure in acoustic communication with the piezoelectric material. The backing structure is configured to reflect acoustic energy towards the sample-contacting portion and away from the back portion of the ultrasonic transducer. The backing structure includes a low acoustic impedance layer and a high acoustic impedance layer. The transducer may also include a second dual layer de-matching backing. The second dual layer de-matching backing includes a second low acoustic impedance layer and a second high acoustic impedance layer. There are also provided ultrasonic transducers including a one-dimensional piezoelectric array or a two-dimensional piezoelectric matrix and including backing structure configured to reflect acoustic energy.

Transducers are provided including a piezoelectric block having first and second opposing surfaces; a first non-piezoelectric layer on the first surface of the piezoelectric block, the first layer including a low density material having a first thickness; and a second non-piezoelectric layer on the second surface of the piezoelectric block, the second layer including a high density material having a second thickness, the second thickness being different from the first thickness and being at least two times the first thickness. Related devices and methods are also provided.

An ultrasonic transducer having a flexible printed circuit board with a thick metal layer and a manufacturing method thereof are disclosed. The ultrasonic transducer, according to an embodiment of the present invention, comprises: an active element that generates an ultrasonic signal, wherein the active element has a thickness of or less at the center frequency of the generated ultrasonic signal; and a flexible printed circuit board that includes a metal layer with a predetermined thickness, which is formed on one surface of the active element and is electrically connected to the active element, wherein the metal layer blocks ultrasonic waves that propagate in an opposite direction to a predetermined travel path of the ultrasonic waves.

Disclosed are an ultrasonic probe for obtaining an ultrasonic image and a manufacturing method thereof. The ultrasonic probe includes a transducer layer including a piezoelectric layer configured to generate ultrasonic waves and an acoustic layer disposed below the piezoelectric layer, and a matching layer disposed above the piezoelectric layer, wherein the transducer layer includes an active portion configured to transmit and receive ultrasonic waves, and a stepped portion extending outward from the active portion to prevent cutting damage of the active portion.

A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.