The ultrasonic transducer includes a case, a piezoelectric vibrator disposed in the case, a wiring member overlapped with the piezoelectric vibrator in the case and inputting signals for vibrating the piezoelectric vibrator received from the outside to the piezoelectric vibrator, and a damper portion provided in the wiring member and adjacent to the piezoelectric vibrator when viewed from the thickness direction of the piezoelectric vibrator.

A shock absorber including a shock absorber body substantially filled with a hydraulic fluid. The shock absorber includes a piston disposed within the shock absorber body that includes a piston head movable within the shock absorber to apply a pressure change in the hydraulic fluid. The shock absorber includes a piezoelectric material disposed within the shock absorber and in fluid communication with the hydraulic fluid. The piezoelectric material is configured to generate an electrical charge in response to the pressure change in the hydraulic fluid. The piezoelectric material is electrically connected to at least one battery configured to receive the electrical charge generated by the piezoelectric material.

An ultrasonic device according to one aspect includes a case, a piezoelectric element, a sound absorbing material, and a vibration-proof material. The case defines a housing space. The piezoelectric element is disposed in the housing space. The sound absorbing material is disposed on a main face of the piezoelectric element and is made of a foaming material. The vibration-proof material is disposed around the sound absorbing material. The sound absorbing material includes a first opposing face opposed to the main face. The first opposing face has an uneven shape in which a plurality of protruding portions and a plurality of depression portions are alternately continued, and is rougher than the main face.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

Disclosed is a piezoelectric transducer which is mounted to a target in use, comprising: a piezoelectric element having a front face which faces the target, and an opposing rear face which faces away from the target, wherein the piezoelectric element has a first acoustic impedance; an compression element located on the rear surface side of the piezoelectric element, the compression element having a second acoustic impedance which is less than the first acoustic impedance; and, a compression mechanism which urges the compression element towards the piezoelectric element such that the compression element is compressed between the compression mechanism and piezoelectric element.

A ferroelectric transducer includes, in part, a first electrode positioned above a substrate; a composite stack positioned above the first electrode, and a second electrode positioned above the composite stack. The composite stack may include one or more alternate layers of a ferroelectric layer and a transition-metal nitride layer. The transition-metal nitride layer can be positioned above a corresponding ferroelectric layer, except the topmost ferroelectric layer in the composite stack. The ferroelectric layer comprises a scandium-doped aluminum nitride (Sc.sub.xAl.sub.1-xN) film, wherein 0<x<1.

A transducer device having a configuration capable of expanding the utilization is provided. A transducer device includes a transducer element, elastic bodies sandwiching the transducer element from two sides and having an elastic modulus smaller than that of the transducer element in a sandwiching direction, a case including an accommodating part for accommodating a transducer unit and having an opening, and an elastic plate member including a support part supported by the case, a facing surface part positioned at the opening of the case and facing the transducer unit, and an elastic deformation part connecting the support part and the facing surface part.

Described are transducer assemblies and imaging devices comprising: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements; a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements; and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.

A touch panel and a display apparatus include a backlight apparatus serving as a supporting substrate, a transparent protective plate that is arranged spaced apart from the backlight apparatus and includes an operating surface on an opposite side of the backlight apparatus; a plurality of vibrators for vibrating the transparent protective plate; and a resilient supporting member arranged between the backlight apparatus and the transparent protective plate to support the transparent protective plate and extend and contract diagonally across a thickness direction of the transparent protective plate.