An optical lens comprising a first lens (L1), a second lens (L2), and a third lens (L3) that are sequentially arranged on a common optical axis in the transmission direction of an incident light. Both the first lens and the second lens are positive plano-convex lenses. The third lens is a negative meniscus lens. The first lens comprises a first curved surface (S1) and a second curved surface (S2). The second lens comprises a third curved surface (S3) and a fourth curved surface (S4). The third lens comprises a fifth curved surface (S5) and a sixth curved surface (S6). The two curved surfaces of each lens respectively are the light incident surface and the light exit surface of the lens. The first to the sixth curved surfaces are sequentially arranged in the transmission direction of the incident light. The first curved surface and the third curved surface protrude in reverse to the transmission direction of the incident light. The fifth curved surface and the sixth curved surface protrude in the transmission direction of the incident light. The third curved surface is constituted by connecting sequentially and directly multiple arced surfaces (1, 2, 3, 4, and 5) having different focuses and all of the focuses (f1, f2, f3, f4, and f5) of these arced surfaces are located on the optical axis. The optical lens is applicable in processing deep and fine holes or engraving deep and fine lines.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

An optical lens comprising a first lens (L1), a second lens (L2), and a third lens (L3) that are sequentially arranged on a common optical axis in the transmission direction of an incident light. Both the first lens and the second lens are positive plano-convex lenses. The third lens is a negative meniscus lens. The first lens comprises a first curved surface (S1) and a second curved surface (S2). The second lens comprises a third curved surface (S3) and a fourth curved surface (S4). The third lens comprises a fifth curved surface (S5) and a sixth curved surface (S6). The two curved surfaces of each lens respectively are the light incident surface and the light exit surface of the lens. The first to the sixth curved surfaces are sequentially arranged in the transmission direction of the incident light. The first curved surface and the third curved surface protrude in reverse to the transmission direction of the incident light. The fifth curved surface and the sixth curved surface protrude in the transmission direction of the incident light. The third curved surface is constituted by connecting sequentially and directly multiple arced surfaces (1, 2, 3, 4, and 5) having different focuses and all of the focuses (f1, f2, f3, f4, and f5) of these arced surfaces are located on the optical axis. The optical lens is applicable in processing deep and fine holes or engraving deep and fine lines.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.

A laser apparatus includes: a first laser device that forms a first beam group; a second laser device that forms a second beam group; an output mirror that constitutes an end of an external resonator; a converging optical system that allows non-parallel incidence of the first and second beam groups on the converging optical system; a diffraction grating disposed at an intersection at which at least a part of the first and second beam groups is superimposed, and having a diffraction effect in a plane perpendicular to a third direction that is a direction perpendicular to first and second directions; and a collimating optical system disposed between the diffraction grating and the output mirror, and collimating the first and second beam groups such that the first and second beam groups are incident perpendicularly on the output mirror while being spatially separated from each other.

A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

Methods and systems for forming a scribe line in a thin film stack on an inner surface of a thin film photovoltaic superstrate are provided via the use of a cleaning laser beam and a scribing laser beam. The cleaning laser beam is focused directly onto the exposed surface of the superstrate such that the cleaning laser beam removes debris from the exposed surface of the superstrate, and the scribing laser beam is focused through the exposed surface of the superstrate and onto the thin film stack such that the scribing laser beam passes through the superstrate to form a scribe within the thin film stack on the inner surface of the superstrate. The method and system can further utilize a conveyor to transport the superstrate in a machine direction to move the superstrate past the cleaning laser source and the scribing laser source.