An ophthalmic laser system includes a laser engine to generate a beam of femtosecond laser pulses, a laser scanner to scan each laser pulse of the beam in three dimensions according to a scan pattern, and a compound lens comprising a glass lens and a birefringent lens, the compound lens arranged to receive the scanned beam and configured to split each laser pulse of the scanned beam into an ordinary pulse and an extraordinary pulse, producing an ordinary beam comprising ordinary pulses and an extraordinary beam comprising extraordinary pulses. A particular ordinary pulse and a particular extraordinary pulse split from a particular laser pulse are spatially separated in depth along an optical axis of the compound lens, by a distance greater than or equal to 5 m, and temporally separated by a delay greater than or equal to a pulse duration of the femtosecond laser pulses. An objective is configured to focus the ordinary beam and the extraordinary beam within an ophthalmic target.

A laser processing apparatus includes: a light flux separating-and-combining device configured to polarize and separate a laser light into two polarized light fluxes having polarization orthogonal to each other and emit the two light fluxes with their optical paths matching each other toward different regions of a spatial light modulator, and configured to combine the two polarized light fluxes modulated by the spatial light modulator and emit the two light fluxes toward a condenser lens; and a controller configured to control hologram patterns presented by the spatial light modulator for respective regions of the spatial light modulator irradiated with the two polarized light fluxes such that the laser light is condensed by the condenser lens at two positions different from each other in a thickness direction inside of the wafer and the same as each other in a relative movement direction of the laser light to form modified regions.

A system comprising a beam source (110) and an optical system (304) comprising first and second portions. The system further comprises first and second torque motors integrated into respective ones of the first and second portions, The first torque motor (420) is configured to rotate first portion (416) around a first axis (434). The second torque motor (426) is configured to rotate second portion (418) around a second axis (436). The first axis is perpendicular to the second axis.

Methods, systems, devices and apparatus for laser processing of transparent or partially transparent materials by focusing laser radiation on a surface of a material workpiece or inside the material workpiece and creating elongated processed regions with variable and controlled depth using focusing optical system with air-spaced optical components, forming three or more multiple focuses along the optical axis and compensating aberrations induced while light focusing inside the material workpiece. The focusing optical system can have an aplanatic design, with lenses made from birefringent materials combined with lenses from isotropic materials, or objectives, or zoom optical system, or waveplates. Material processing effects such as material disruption or modification of material properties are produced due to the interaction of focused laser radiation with material in elongated volume processed regions and are multiple repeated along the processing path by relative motion between the material workpiece and the focusing optical system being realized with a scanning device.

A method for spatial and intensity control of remote foci locations of an optical beam generated from a light source. First and second, axially-aligned, non-diffractive foci are created by passing the optical beam through a phase mask and a Fourier lens. The phase mask q(s) is designed to have an axial response according to the following equation: $E\left(u\right)={}_{-}^{+}q\left(s\right)\exp \left(-2u_{0}s\right)\exp \left(2\mathrm{us}\right)\mathrm{ds}.$
The properties of the phase mask may be altered to independently vary location and intensity of the first and second foci.

A direct diode laser processing apparatus includes a laser oscillator that emits a multiple-wavelength laser beam, a transmission fiber that transmits the multiple-wavelength laser beam emitted from the laser oscillator, and a laser processing machine that condenses the multiple-wavelength laser beam transmitted through the transmission fiber and processes a workpiece. According to chromatic aberrations of the multiple-wavelength laser beam and the wavelength dependence of emissivity of the workpiece, a light intensity distribution of the multiple-wavelength laser beam in a thickness direction of the workpiece is provided with a plurality of peaks.

Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 ?m, a second diameter at the second surface wherein the first diameter is less than or equal to 100 ?m, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A multiple wavelength laser processing system is configured with a multiple wavelength laser source for generating a multiple wavelength coaxial laser processing beam. The laser processing system further includes a multiple wavelength optical system to deliver the coaxial laser processing beam to a laser-material interaction zone on the surface of a workpiece such that each of the first and a second laser wavelengths in the processing beam impinge at least a portion of the interaction zone as respective first and second concentric laser spots. The multiple wavelength optical system includes a multiple wavelength beam collimator, a configurable chromatic optic, and a laser processing focus lens, wherein the configurable chromatic optic provides an adjustment to the relative focus distance of the first and second laser wavelengths.

An apparatus includes a focusing element arranged to focus a high-energy beam on a workpiece, an image detector for recording at least one image of an area to be monitored on the surface of the workpiece and/or the reference contour; imaging optics arranged to (a) receive process radiation radiation through the focusing element, from an area of the workpiece and/or the reference contour to be monitored, in the form of a first monitoring beam that is non-coaxial with the high-energy beam between the workpiece and the imaging optics and (b) redirect the first monitoring beam to the image detector to provide the at least one image of the area to be monitored and/or the reference contour; and an evaluation device operable to determine the focus position of the high-energy beam based on the at least one recorded image.