Disclosed herein is a laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from, the front side of the wafer to the back side thereof, by one shot of the laser beam.

A method for laser-based deep welding of at least two parts to be joined, in which a laser beam device generates a laser beam with a deep welding laser beam component, which is moved at a feed rate along a joint. The deep welding laser beam component generates a vapor capillary in the material of the parts to be joined, which capillary is surrounded by a melt pool and which moves with the laser beam in the welding direction through the material of the parts to be joined, forming a capillary flow, in which a metal melt located at the capillary front flows via melt pool channels formed on both sides of the vapor capillary in the direction of the capillary rear side and solidifies there.

A method for laser processing a workpiece is provided. The workpiece includes a material transparent to a laser beam of the laser processing. The method includes splitting an input laser beam by using a beam splitter into a plurality of partial beams. The splitting of the input laser beam is performed by application of phases to a beam cross section of the input laser beam. The method further includes focusing the plurality of partial beams decoupled from the beam splitter by using a focusing optical unit. Multiple focus elements are formed by the focusing of the plurality of partial beams. The method further includes subjecting the material of the workpiece to at least a subset of the multiple focus elements. The application of the phases is performed in such a way that at least two of the multiple focus elements have different intensities.

A substrate manufacturing apparatus includes a stage on which a semiconductor substrate is disposed. The substrate manufacturing apparatus includes an irradiation unit that irradiates the semiconductor substrate disposed on the stage with a pulsed laser of a predetermined pulse period. The substrate manufacturing apparatus includes a controller that controls a relative position between the stage and the irradiation unit. The irradiation unit generates a plurality of converging points arranged on a straight line at a predetermined pitch. The controller moves the relative position between the stage and the irradiation unit at a predetermined speed in parallel to the straight line on which the plurality of converging points are arranged. The predetermined speed is a speed at which a moving distance of the plurality of converging points in one period of the predetermined pulse period is the same as the predetermined pitch.

A laser processing apparatus including a condenser having a function of spherical aberration. Since the condenser has a function of spherical aberration, the focal point of a laser beam to be focused by the condenser and applied to a wafer can be continuously changed in position along the thickness of the wafer. Accordingly, a uniform shield tunnel composed of a fine hole and an amorphous region surrounding the fine hole can be formed so as to extend from the front side of the wafer to the back side thereof, by one shot of the laser beam.

An optical processing apparatus, an optical processing method, and an optically-processed product production method. The optical processing apparatus and the optical processing method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period of time in which plasma or gas is generated inside the object to be processed, by the first process light, using a second light-emitting unit. The processed product production method includes emitting a first process light to a focal point set inside an object to be processed, using a first light-emitting unit, and emitting a second process light during a period in which plasma or gas is generated inside the object to be processed by the first process light, using a second light-emitting unit.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A fiber output hybrid laser system, which having at least a blue ray laser model, emitting a blue ray laser beam; an infrared optic fiber laser module, emitting an infrared laser beam; a fiber bundle combining the above mentioned two laser beams, an output optical assembly collimating the laser beams, and generating focal points of two wavelengths; wherein the blue ray laser beam and the infrared laser beam which are coaxial and coincident to emit light, and the BPP of the blue ray laser beam and the infrared laser beam are both less than 10 mm*mrad; the power of the blue ray laser beam is between 20?100 W, the power of the infrared laser beam is between 500?5000 W, so as to obtain the best welding and cladding effects.

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.