Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 ?m, a second diameter at the second surface wherein the first diameter is less than or equal to 100 ?m, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

A laser processing device includes plural laser sources and a focusing section that focuses respective light beams of the plural laser sources to form plural focus points on a workpiece, and that focuses such that respective portions of at least some of the plural focus points are overlapping.

Disclosed are a laser processing method for cutting a semiconductor wafer having a metal layer formed thereon and a laser processing device. The disclosed laser processing method transmits a plurality of laser beams, which propagate coaxially, to the semiconductor wafer, thereby forming focusing points in positions adjacent to a surface of the metal layer, which constitutes a boundary with the semiconductor wafer, and to one surface of the semiconductor wafer, respectively.

An apparatus for radiatively scribing a planar semiconductor substrate along a scribelane that extends between opposing rows of semiconductor devices on a target surface of the substrate. The scribelane extends parallel to a first direction parallel to a second direction, these first and second directions lying respectively parallel to X and Y axes of a Cartesian coordinate system. Such an apparatus may include an illuminator for producing an array of light beams; a projection system for focusing the light beams onto the target surface; an actuator system for causing relative displacement of a substrate holder with respect to light beams parallel to an XY plane; and an adjustable spatial filter located between the illuminator and the substrate holder, and including motorized plates whose position is adjustable so as to at least partially block selectable light beams of the light beam array.

A method for laser processing a transparent workpiece includes forming a contour line having defects in the transparent workpiece, which includes directing a pulsed laser beam oriented along a beam pathway through a beam converting element and through a phase modifying optical element such that the portion of the pulsed laser beam directed into the transparent workpiece includes a phase shifted focal line having a cross-sectional phase contour that includes phase contour ridges induced by the phase modifying optical element and extending along phase ridge lines. Moreover, the phase shifted focal line generates an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece including a central defect region and a radial arm that extends outward from the central defect region in a radial defect direction oriented within 20 of the phase ridge lines of the phase shifted focal line.

A non-ablative method and apparatus for making an economical glass hard disk (platter) for a computer hard disk drive (HDD) using a material machining technique involving filamentation by burst ultrafast laser pulses. Two related methods disclosed, differing only in whether the glass substrate the HDD platter is to be cut from has been coated with all the necessary material layers to function as a magnetic media in a computer's hard drive. Platter blanks are precisely cut using filamentation by burst ultrafast laser pulses such that the blank's edges need not be ground, the platter's geometric circularity need not be corrected and there is no need for further surface polishing. Thus the platters can be cut from raw glass or coated glass. As a result, this method reduces the product contamination, speeds up production, and realizes great reductions in the quantity of waste materials and lower production costs.

A method of producing a spiral cut transparent tube using laser machining includes using an ultrafast laser beam comprising a burst of laser pulses and focusing the laser beam on the transparent tube to enable relative movement between the laser beam and the transparent tube by moving the laser beam, the glass tube or both the laser beam and the glass tube. A beam waist is formed external to the surface of the transparent tube wherein the laser pulses and sufficient energy density is maintained within the transparent tube to form a continuous laser filament therethrough without causing optical breakdown. The method and delivery system makes a spiral cut in the transparent tube.

A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.

A laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. A plurality of rows of modified regions include at least an entrance-surface-side modified region located on the laser light entrance surface side, an opposite-surface-side modified region located on the opposite surface side of the laser light entrance surface, and a middle modified region located between the entrance-surface-side modified region and opposite-surface-side modified region. When forming the middle modified region, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction. When forming the entrance-surface-side modified region and opposite-surface-side modified region, the spatial light modulator is restrained from displaying the axicon lens pattern as the modulation pattern.

A welding or cladding apparatus in which one or more energy beam emitters are used to generate a wide beam spot transverse to a welding or cladding path, and one or more wide feeders feed wire to the spot to create a wide welding or cladding puddle.